This study is an updated version of a report published in 2007. The objective of this report is to review and analyze electromagnetic interference (EMI) and radio frequency interference (RFI) problems that are encountered in operation of electronic equipment and implications for plastics and competitive materials/technologies used to suppress that interference.
There are several important differences between the shielding industry of today compared with several years ago, led by the increased number and quality of devices and components requiring shielding.
Another issue is the ever-increasing frequencies being encountered along with the proliferation of wireless devices that may result in shifting of shielding options. In addition, the impact of other technologies such Bluetooth, absorptive EMI, fiber optics, and others will be assessed. This study will analyze effects on material usage caused by these and other issues.
SCOPE AND FORMAT
The size and the growth of the global market for EMI/RFI shielding products is a function of several factors. Shielding not only closely follows the demand for electronic devices and components but also is a valuable resource to assist manufacturers in complying with ever-changing safety and performance regulations. Consequently, the study summarizes the somewhat muddled global regulatory environment.
The overview identifies the nature of the EMI/RFI problem, noting how shielding and electronics redesign can, in some instances, overcome these problems. Technologies and materials specific to EMI/RFI shielding are identified and analyzed for their impact on plastics and other materials within a context of trends in components and devices used in the electronics and other industries such as medical, automotive, and consumer products.
The report begins with an understanding of the issues involved, current state of the electronics and other industries, market for plastics-based shielding options, key participants, shielding technologies, patents, materials, shielding components, a “time line” of global developments, and worldwide regulatory and standards environment for electronic shielding.
Compound annual growth rates (CAGRs) are provided by square feet and 2011 dollars. An analysis based on volume is not feasible because of the many disparate shielding products.
Both primary and secondary research methodologies were used in preparing this report. Specifically, the following procedures were used to gather information:
- A review of EMI supplier literature
- An analysis of the electronic industry in terms of EMI shielding
- Contacts with EMI suppliers, trade associations, editors of trade magazines, and other knowledgeable sources.
CONTRIBUTION OF THE STUDY
With each successive analysis, BCC Research updates participants in the plastics and electronics industries on evolving needs for plastics EMI shielding in enclosures for electronic equipment being manufactured. Advantages and disadvantages, plus overall cost-effectiveness of the various materials and techniques that electronics original equipment manufacturers (OEMs) and systems assemblers are utilizing to shield their plastic enclosure parts, are reported.
This market research offers resin manufacturers, plastics compounders, and plastics processors with an analysis of factors that impact on their ability to serve the electronics industry with neat and/or filled resins. Concurrently, electronics design engineers and electronics OEMs, and assemblers can evaluate cost/performance advantages of various plastics shielding methods for their particular applications.
Research analyst Mel Schlechter has more than 40 years in the chemical industry and specializes in plastics market research. He has been with BCC Research for more than 10 years and holds a BS in chemistry, an MS in organic chemistry, and an MBA in marketing.
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The information developed in this report is intended to be as reliable as possible at the time of publication and of a professional nature. This information does not constitute managerial, legal, or accounting advice; nor should it serve as a corporate policy guide, laboratory manual, or an endorsement of any product, as much of the information is of a speculative in nature. The author assumes no responsibility for any loss or damage that might result from reliance on the reported information or from its use.