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Plastics

Plastics in Electronic Components

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REPORT HIGHLIGHTS

  • Thermoplastic and thermoset volumes, estimated at slightly over 586 million pounds in 2006 should reach over 700 million pounds by 2011 corresponding to an annual growth rate of 4.3%.
  • Thermoplastics will have the highest growth rate through the forecast period at 4.8%. Consumption is almost 400 million pounds in 2006 and should grow to just over 500 million pounds in 2011.
  • In terms of technology driven factors, miniaturization is still an important factor, although it is beginning to reach its saturation point; thinwalling of molded parts; and higher soldering temperatures due to surface mount technologies (SMT) and lead-free soldering have been some of the key parameters affecting choices and volumes of plastics being used to mold components. These factors will drive the use for resins with higher heat deflection temperatures (HDTs) and glass transition temperatures (Tgs) and lower dielectric constants.

SUMMARY FIGURE
NORTH AMERICAN CONSUMPTION IN ELECTRONIC COMPONENTS BY TYPE OF RESIN, 2005-2011
(MILLION POUNDS)
Source: BCC Research

Also See
PLS027A - July 2002
Upcoming Report
PLS027C - March 2012