Sputtering is one of the most common and widely used technologies for thin film manufacturing. Quality of deposited films, however, not only depends on process and equipment parameters (such as vacuum conditions, temperature or equipment design) but also on the configuration and characteristics of the targets and the critical raw materials used for sputtering. In fact, target properties such as purity, density, shape, grain size and distribution or manufacturing process, directly affect the microstructure at the atomic level of the sputtered film.
This BCC report provides a complete understanding of advances in thin film deposition and closely evaluates and monitors improvements and recent developments in sputtering target technology and manufacturing processes, while providing market forecasts through 2010.
Since BCC’s last study on this subject, published in 2002, target fabrication technologies have evolved. In addition, several applications for sputtering, other than traditional semiconductors and data storage media, are emerging as very fast growing markets for these products.
The report contains:
- Descriptions of the most current methods for fabricating sputtering targets and the most advanced sputtering methods
- Comparisons to traditional processes and other competing thin film deposition technologies
- A review of materials used
- Highlights of new technological developments while outlining technical issues
- Evaluation of several fields of applications and investigations of those now emerging
- Estimates of current worldwide markets for targets and films with forecasts through 2010
- Identification of the major producers of sputtering targets
- Analysis of trends in U.S. and worldwide patents issued in the most recent years.
BCC's market analysis is essentially divided into seven parts.
In the first part, the sputtering process is reviewed, and an updated and comprehensive description of conventional and innovative sputtering technologies is provided. In addition, the report outlines the major technological factors affecting the sputtering process and supplies a comparison with competing thin film deposition methods.
The second part of the study entails a detailed description of sputtering target types, raw materials, applications and production methods. The various steps contributing to target fabrication are also reviewed in this section. This part of the report is completed by an analysis of the most important technological developments and improvements to date, and examples of significant patents recently issued or in process are included.
In the third part, a summary of the overall worldwide sputtered film and sputtering target market is supplied and global revenues (sales data in M$) are presented by application, material type and region, with actual data referring to the years 2003 through 2005. Forecasts for the period 2005 through 2010 are also supplied.
Next, details of the worldwide market analysis are covered. For each major group of applications (specifically microelectronics, data storage media, advanced displays, mechanical/chemical devices, energy supply/management devices, optical coatings and others), BCC provides a description of the industry, raw materials, sputtered film properties and market data by device, material and region. Growth trends and forecasts through 2010 are also supplied for each group of applications.
In the fifth part, covering the worldwide industry structure, the report supplies a list of the leading manufacturers of sputtering targets and sputtered films together with a description of their products. The analysis includes the description of the geographical distribution of these suppliers and a comparison between manufacturing and consumption, always from a geographical standpoint. Detailed company profiles and relative market share of the top 25 players are also offered.
In the sixth part of this study, an analysis of industry competitiveness is performed, which encompasses a review of worldwide research and development activities, divided by region, and an outline of the most critical factors contributing to industry competitiveness.
The seventh and final section includes extensive worldwide patent analysis for the period 2002 (when BCC's last report was published) to 2005. Patents are analyzed by country, assignee(s), and material type.
To perform this study BCC, Inc. analyzed 92 manufacturers of sputtering targets, accounting for at least 90% of the worldwide market. Data for each company were obtained by thoroughly analyzing SEC filings, Internet Web sites, annual reports, industry directories, industry magazines, government sources, and other public sources.
Additional data were obtained from the direct contribution of primary sources including company executives, managers, engineers and other technical personnel representing target manufacturers and sputtering equipment suppliers, and various industry market analysts.
Secondary sources of information include:
- EDGAR - U.S. Securities and Exchange Commissions Filings
- U.S. Patent and Trademark Office
- Company Web Sites
- Company Annual Reports
- Thomas Registers
- Moody's Directory
- S & P Industry Survey
- Dun & Bradstreet Directory
- American Ceramic Society Annual Meeting Abstract
- Foreign Chamber of Commerce Directories
- Foreign Stock Exchange Listings
Margareth Gagliardi has over 20 years of experience in the field of advanced materials, specializing in ceramic formulations, materials processing and new product development. She has held management positions in both manufacturing and R&D with U.S. and European firms producing electronic, mechanical, chemical and structural components. She holds a B.S. in Chemical Engineering and a M.S. in Ceramic Engineering.
Report Code: SMC037C, Published: October 2005, Analyst: Margareth Gagliardi
