Flexible Green Packaging: Global Market Through 2022
The global market for flexible green packaging is expected to reach $395.0 billion by 2022 from $273.4 billion in 2017 at a compound annual growth rate (CAGR) of 7.6% from 2017 to 2022.
- 57 data tables and 27 additional tables
- An overview of the global flexible green packaging market
- Analyses of global market trends, with data from 2016 and 2017, and projections of compound annual growth rates (CAGRs) through 2022
- Coverage of types, including stand-up pouches, vacuum pouches and bags, retort pouches, gusseted bags, wicketed bags, and squeezable bottles
- Details concerning applications, including food, beverage, medical, and personal-care products
- Analysis of what trends are influencing the market now, and what to expect in the near future
- Company profiles of major players in the market, including Amcor Ltd., Bemis Co. Inc., Graphic Packaging Holding Co., Printpack Inc. and Sealed Air Corp.
This report provides an in-depth analysis of the global flexible green packaging market by materials, applications and regions. The report discusses the application of different commercially available flexible green packaging to derive specific market estimations. The report discusses a comparative study of conventional and emerging technology, and the importance of the technological advancement in flexible green packaging market. The report also discusses strategies adopted by major players in the global flexible green packaging market. Patent analysis imparted in the report provides a snapshot of technological trends in the global market over time as well as geographically-namely for the U.S., Europe and Japan. The global flexible green packaging market is segmented based on materials, applications and regions.
Estimated values used are based on the manufacturers’ total revenues. Projected and forecasted revenue values are in U.S. dollars, unadjusted for inflation.
Abhigyan Sengupta is an economist with nearly 15 years of experience in the field of marketing research. He has authored many reports pertaining to semiconductors and electronic devices, chemicals, and the fast-moving consumer goods (FMCG) industries, and is currently mentoring a team of analysts in this domain.
He has headed the electronic domains of many research companies. He was formerly an analyst with Frost & Sullivan, specializing in the displays and electronic components industry in North America. Mr. Sengupta has published reports on flat-panel displays, light-emitting diodes (LCDs), organic light-emitting diodes (OLEDs), industrial and building automation, solid-state transformers, traction transformers, ceramic capacitors, electric double-layer capacitors (EDLCs) as well as other industrial arenas.
Mr. Sengupta has also worked closely with the Best Practices team at Frost & Sullivan and has also been aligned closely with companies such as Schneider, ABB Group, Samsung, NEC and AVX, BASF, Kraft, and Danone, among others.
Formerly the head of the Department of Economic Affairs and Government Policy at the Automotive Components Manufacturers Association (ACMA) of India, Mr. Sengupta brings with him considerable knowledge and skills. He also has been associated with a leading industry association in the automotive domain, as well as in the electronic components sector.
Mr. Sengupta also was part of the Automotive Components Manufacturers Association (ACMA) delegation in the World Trade Organization (WTO), the Hong Kong Ministerial Conference in Dec. 2005, and is well-versed in international trade policies and WTO affairs.