Plastics in Electronic Components

Published - Sep 2006| Analyst - Melvin Schlechter| Code - PLS027B
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Report Highlights

  • Thermoplastic and thermoset volumes, estimated at slightly over 586 million pounds in 2006 should reach over 700 million pounds by 2011 corresponding to an annual growth rate of 4.3%.
  • Thermoplastics will have the highest growth rate through the forecast period at 4.8%. Consumption is almost 400 million pounds in 2006 and should grow to just over 500 million pounds in 2011.
  • In terms of technology driven factors, miniaturization is still an important factor, although it is beginning to reach its saturation point; thinwalling of molded parts; and higher soldering temperatures due to surface mount technologies (SMT) and lead-free soldering have been some of the key parameters affecting choices and volumes of plastics being used to mold components. These factors will drive the use for resins with higher heat deflection temperatures (HDTs) and glass transition temperatures (Tgs) and lower dielectric constants.

INTRODUCTION

This study focuses on plastics usage in the electronics industry. It is not a review of the entire electronics industry but deals with development of resins and resin grades to meet requirements of electronic technologies related to computers, telecommunications, automotive, and other major industries employing electronic components.

SCOPE OF STUDY

This report contains:

 

  • A detailed market overview of plastics in electronic components, specifically covering resins and resin grades to meet requirements of electronic technologies related to computers, telecommunications, automotive, and other industries employing electronic components
  • An analysis of the North American market and its upcoming trends, with detailed tables and a five-year forecast through 2011
  • An examination of technological trends in the market, both recent and forthcoming
  • A detailed list of profiles for the top contributors in the industry as well as a detailed patent analysis.

 

METHODOLOGY

A comprehensive review was undertaken of literature relating to resins used to produce electronic components, their applications, technology, markets and new developments. Included in the review were supplier trade literature, texts, and monographs. Unresolved issues were clarified by contact with those involved in the industry.

ABOUT THE AUTHOR

Research analyst Mel Schlechter has over 40 years in the chemical industry, and specializes in plastics market research. He has been with BCC Research for over 10 years and holds a B.S in chemistry, M.S. in organic chemistry and a M.B.A. in marketing.

Table of Contents & Pricing

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Published - Jul-2002| Analyst - Melvin Schlechter| Code - PLS027A

Report Highlights

  • The total annual consumption of plastics in electronic components in North America was just over 415 million pounds in 2001 and will rise at an AAGR (average annual growth rate) of 3.9% to 503 million pounds in 2006.
  • Thermoplastics account for 65% of the market, and growing at a higher AAGR of 4.8% will take nearly 68% in 2006.
  • Thermosets will rise at an AAGR of just 2.2% from 145 million pounds to 162 million pounds.
  • Three specific applications, namely PCB laminates, encapsulation, and connector molding account for more than 80% of total market volume of the market.
  • Nearly 57% of plastics are consumed in stationary computers and peripherals, a number that will dip slightly by 2006.
  • The share for portable applications will rise from 7.1% in 2001 to 11.1% in 2006.

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