Flip-Chip Technologies and Global Markets

Published - Jul 2016| Analyst - Sinha G. Gaurav| Code - SMC089B
Flip-Chip Technologies and Global Markets
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Report Highlights

The global market for flip-chip technology totaled $24.9 billion in 2015. The market should total $27.2 billion and $41.4 billion in 2016 and 2021 respectively, increasing at a compound annual growth rate (CAGR) of 8.8% from 2016 to 2021.

Report Includes

  • An overview of the global markets for flip-chip technologies, a process to interconnect IC’s and other microelectronics devices (MEMS) to the external circuitry by means of a solder bumping process deposit on pads.
  • Analyses of global market trends, with data from 2015, 2016, and projections of compound annual growth rates (CAGRs) through 2021.
  • Discussion of the evolution, architecture, and value chain of flip-chip technologies.
  • Examination of market dynamics, including drivers, restraints, and opportunities.
  • Analysis of the flip-chip assembly markets by geography, including North America, Europe, Asia-Pacific, and others.
  • Coverage of the competitive landscape, including mergers and acquisitions, collaborations and agreements, and new product development.
  • Profiles of major players in the industry.

Report Scope

The market for flip-chip technology is segmented by the following categories:

  • Wafer bumping process.
    • Copper (Cu) pillar. 
    • Lead (Pb)-free solder. 
    • Tin-lead (Sn-Pb) eutectic solder. 
    • Gold stud + plated solder.
  • Application area.
    • 2-D logic system-on-a-chip (SoC).
    • Memory. 
    • Imaging, high-brightness light-emitting diode (HB-LED) small logic. 
    • Radio-frequency (RF), power, analog, and mixed-signal integrated circuits (ICs). 
    • µ-bumping for 2.5-D/3-D system-in-package/system-on-a-chip (SiP/SoC).
  • End use.
    • Smartphones. 
    • Laptops. 
    • Desktop CPUs. 
    • Graphics processing units (GPUs) and chipsets. 
    • Other computing devices. 
    • Automotive. 
    • Robotics. 
    • Medical devices. 
    • Smart technologies. 
    • High-performance/industrial applications.
  • Region.
    • North America (the U.S., Canada and Mexico).
    • Europe (Italy, France, Germany, U.K., and other countries). 
    • Asia-Pacific (China, Japan, Taiwan, South Korea, India. and other countries). 
    • ROW (Middle East and Africa).

This report also provides a competitive analysis of the industry, a patent analysis, and a chapter including company profiles. All estimated values used are based on manufacturers’ total revenues, and are given in current U.S. dollars, unadjusted for inflation.

Analyst Credentials

Sinha G. Gaurav focuses on electronics and semiconductors markets, robotics and nanotechnology. His publications range from factory automation and big data to industrial controls and helmet-mounted displays. He holds a bachelor's degree in electrical engineering from Rajasthan University and an MBA degree in finance from ICFAI Business School.

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Published - Jan-2014| Analyst - Sinha G. Gaurav| Code - SMC089A

Report Highlights

The global market for Flip Chip Technology by wafer bumping process reached $18.9 billion in 2012. This market is expected to grow to $20.1 billion in 2013 and $36.5 billion in 2018, a compound annual growth rate (CAGR) of 12.7% over the five-year period from 2013 to 2018.

Report Includes

  • An overview of the global market for flip-chip technologies, a process to interconnect IC’s and other microelectronics devices (MEMS) to the external circuitry by means of a solder bumping process deposit on pads.
  • Analyses of global market trends, with data from 2012, estimates for 2013, and projections of compound annual growth rates (CAGRs) for the period, 2013 to 2018.
  • Discussion of the evolution, architecture, and value chain of flip-chip technologies.
  • Examination of market dynamics, including drivers, restraints, and opportunities.
  • Analysis of the flip-chip assembly market by geography, including North America, Europe, Asia-Pacific, and others.
  • Coverage of the competitive landscape, including mergers and acquisitions, collaborations and agreements, and new product development.
  • Comprehensive company profiles of major players.
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