Advanced Semiconductor Packaging Market Global Industry Analysis, Size, Share, Growth, Trends and Forecast 2017 - 2029

Global Advanced Semiconductor Packaging Market- Research Methodology

The report on the global advanced semiconductor packaging market offers key insights on the market with help of the data obtained from primary and secondary research. The report has used top-down and bottom-up approach to provide expected market size. The report also offers insights on all the major factors playing an important role in the market growth. The report also includes key trends, market opportunities, factors driving the global market and factors hampering the growth of the market.

During the primary research interview of industry experts was conducted and information provided by them was crosschecked with various data sources. Both micro-economic and macro-economic factors were also taken into account to provide important information on the global as well as regional advanced semiconductor packaging market.

The report also offers segment-wise analysis and region-wise analysis of the global advanced semiconductor packaging market. The secondary research was done to gather data on the market. Sources used in the secondary research included investor presentations, annual reports and financial reports of the major companies. Absolute dollar opportunity is also provided in the report to identify various market opportunities.

The report comprises vital information on the key companies operating in the global advanced semiconductor packaging market. The report enlightens on the key business strategies, developments, new product launch by the key market players. The report also includes details on the regulations in the market across the globe. The report also focuses on the technological advancements in the market and how new technologies will impact the growth of the market in future.

Global Advanced Semiconductor Packaging Market- Segmentation

The global advanced semiconductor packaging market is segmented based on packaging type, application, end user, and region. On the basis of packaging type, the advanced semiconductor packaging market is divided into Fan-Out Wafer-Level Packaging (FO WLP), Fan-In Wafer-Level Packaging (FI WLP), Flip Chip (FC), and 2.5D/3D.

On the basis of application, the market is divided into application processor/ baseband, central processing units/graphical processing units, dynamic random access memory, NAND, image sensor, and other applications.

Based on the end user, the market is divided into telecommunications, automotive, aerospace and defense, medical devices, consumer electronics, and other end users.

Region-wise the global market for advanced semiconductor packaging is segmented into Japan, Asia Pacific Excluding Japan (APEJ), Europe, North America, Latin America, and the Middle East and Africa (MEA).

Competitive Landscape

Some of the key players in the global advanced semiconductor packaging market are Intel Corp, AMD, Amkor Technology, Hitachi Chemical, STMicroelectronics, Infineon, Sumitomo Chemical Co. Ltd., Avery Dennison, Kyocera, and ASE Group.

Leaders in analytics, research and advisory services for Fortune 500 companies, scores of high potential startups, and financial institutions. Our success stories have proven why we are a prominent provider of a cutting-edge syndicated and customized research services. Leverage the best of our seasoned research analysts who had a keen interest and enviable expertise of almost 4 million hours in global, regional, and local market intelligence.