April 23, 2019
WELLESLEY, Mass., April 23, 2019–Global interest in electronics and energy devices that are thin, lightweight and bendable is driving the flexible devices roll-to-roll tech market, according to a report by BCC Research, “Global Markets for Roll-to-Roll Technologies for Flexible Devices.”
The market expects to see a compound annual growth rate (CAGR) of 14.3% through 2023, when it could be worth $41.3 billion.
“Although the first flexible circuits were produced in the early 1900s, introduction of roll-to-roll technologies for manufacturing these circuits occurred many years later in Japan during the 1980s,” notes report author Margareth Gagliardi. “Since then, utilization of R2R methods has become more common, and various processes have been adapted for creating patterns on flexible substrates.”
Patent Activity Dominated by the U.S., South Korea
Though the market is global, patent activity is decidedly regional. From 2017 to 2018, there were 34 patents filed in the U.S., which accounted for more than 53% of all patent activity. The Asia-Pacific region saw 29 patents, or 45.3% of activity, with all of Europe seeing just one patent and the Rest of the World seeing none. In Asia, South Korea was the home of 23.4% of patents for the period while China and Japan followed with shares of 9.4% and 7.8%, respectively.
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Global Markets for Roll-to-Roll Technologies for Flexible Devices( SMC082C )
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