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System-in-Package (SiP) Die Technologies and Global Markets

  • Published: February 2014
  • |
  • Report Code: SMC091A

REPORT HIGHLIGHTS

Global sales for System-in-Package (SiP)-based chipsets totaled nearly $15 billion in 2012. This market is expected to grow at a compound annual growth rate (CAGR) of 6.7% from nearly $16.3 billion forecast for 2013 to $22.5 billion forecast for 2018.

This report provides:

  • An overview of the global market for System-in-Package (SiP) chipsets.
  • Analyses of global market trends, with data from 2012, estimates for 2013, and projections of compound annual growth rates (CAGRs) through 2018.
  • A breakdown of the market along two major criteria; die technologies and end-use applications.
  • A look at many market verticals including telecommunications; medicine; computing and entertainment; consumer electronics, instrumentation and scientific research; energy, defense, and surveillance; and industrial and automotive.
  • Comprehensive profiles of leading companies in the industry.

SAMPLE FIGURE
DOLLAR SALES FOR SIP-BASED CHIPSETS, BY REGION, 2011–2018
($ MILLIONS)
DOLLAR SALES FOR SIP-BASED CHIPSETS, BY REGION, 2011–2018
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Source: BCC Research

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REPORT SCOPE

SCOPE OF THE REPORT

The report measures and forecasts the size of the market in current U.S. dollars as well as in millions of shipment units for chipsets packaged using SiP.

The report forecasts the market size for the following:

  • Individual end-use application such as telecommunications; instrumentation and scientific research; medicine; energy, defense and surveillance; consumer electronics; industrial and automotive; retail; and others. 
  • The above forecasts are classified in terms of die compositions, geographical regions and countries on volume and value bases; they are also classified in terms of value chain contributors on a value basis.

The Executive Summary provides a snapshot of key findings of the report.

The chapter on theoretical overview of SiP defines SiP and explains its morphology. SiP is placed in the context of other advanced packaging techniques, and a wider view is presented of where semiconductor packaging itself fits in the device-synthesis chain. The chapter dwells on simple and compound semiconductors and elaborates their pros and cons. Further, a high-level view of the SiP market is provided.

The chapter on global markets for SiP-enabled chipsets provides a closer look at the global market for those chipsets. End-use applications are used as the principal classification factor, and individual end-application markets are broken down by region and die composition.

The chapter on regional analysis for the Americas presents an overview of the region and the overall market metrics, followed by analyses of individual major countries such as the U.S., Brazil, Canada and Mexico.

The chapter on regional analysis for EMEA presents an overview of the region and the overall market metrics, followed by analyses of individual major countries such as Germany, France, the U.K., Spain, Italy, Russia, the Netherlands and Turkey.

The chapter on regional analysis for APAC presents an overview of the region and the overall market metrics, followed by analyses of individual major countries such as China, Japan, India, South Korea and Indonesia.

The chapter on major stakeholders and key companies identifies the influential stakeholder categories and leading companies that dominate the market for SiP-based chipsets.

The U.S. Patent Analysis chapter analyzes the U.S. patents granted in the relevant areas of SiP. The chapter classifies the patents awarded according to categories such as: analog–digital converter (ADC), digital–analog converter (DAC), radiofrequency (RF), antenna and other communication-component-specific integration; assembly and integration end-to-end process; bond, resin, solder, interposer and lead frame; design and alignment; die stacking and side-by-side placement facilitation; end-application-specific innovation-data transmission; memory-component-specific innovation; passive component integration; performance testing and verification; and power management, heat sink, inductor and capacitor.

ABOUT THE AUTHOR

Kaustubha Parkhi has worked in a broad range of functional roles with leading telecommunications operators and service providers such as Reliance Infocomm, Ramco Systems and BPL Cellular. He has written on an array of telecommunications and electronics-related subjects based on his critical analysis of the underlying technology and its business impact. Kaustubha holds a Bachelor of Engineering (equivalent to a Bachelor of Science) in Electronics and Telecommunications and a Master of Business Administration in Systems.

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REPORT TOC

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Pricing on the website is provided for single users and 2-5 users licenses only. All reports will be provided in a PDF format for download. To purchase multi-user licenses, please contact us at (+1)781-489-7301 or send an email to information@bccresearch.com
  Title/Chapter Name Pages Price
System-in-Package (SiP) Die Technologies and Global Markets 173 $6650
Chapter- 1: INTRODUCTION - Complimentary 5 $0
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Chapter- 2: EXECUTIVE SUMMARY 3 $250
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Chapter- 3: THEORETICAL OVERVIEW OF SIP 27 $1557
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Chapter- 4: GLOBAL MARKETS FOR SIP-ENABLED CHIPSETS 26 $1499
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Chapter- 5: REGIONAL ANALYSIS-AMERICAS 20 $1153
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Chapter- 6: REGIONAL ANALYSIS-EMEA 34 $1960
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Chapter- 7: REGIONAL ANALYSIS-APAC 24 $1384
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Chapter- 8: MAJOR STAKEHOLDERS AND KEY COMPANIES 25 $1441
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Chapter- 9: U.S. PATENT ANALYSIS 9 $519
  Show Details
 
  List of Tables
  List of Figures
 
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