The global market for resins used in electronic components reached 3.4 billion pounds in 2011. It is expected to reach 3.5 billion pounds in 2012 and it will further grow to 4.4 billion pounds by 2017, a compound annual growth rate (CAGR) of 4.7%.
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SCOPE AND FORMAT
This study covers all electronic components where plastics are used to a significant extent in mostly molding electronic components and excludes fiber optics, wire and cable, enclosures, recording media, etc. This study covers single devices (e.g., connectors, capacitors, switches, bobbins), multiple-component devices (e.g., printed circuit boards, interconnects, etc.) and encapsulants.
In addition, key participants in the electronic components industry in terms of resin producers, and molders are identified along with inclusion of key technologies, and the competitive resin scenario.
ABOUT THE AUTHOR
Research analyst Mel Schlechter has more than 40 years in the chemical industry, and specializes in plastics market research. He has been with BCC Research for more than 10 years and holds a B.S. in chemistry, an M.S. in organic chemistry, and an M.B.A. in marketing.