REPORT SCOPE
INTRODUCTION
STUDY BACKGROUND
In recent years, tremendous progress has been made, technologically and in terms of demand, in electronic devices and systems. The technological progress has come on two main fronts: increased functionality on a single device unit and miniaturization of each unit. Both of these developments have increased the need for thermal management technologies, including thermal interface materials (TIM).
In the thermal management of microelectronics, the interface material layer between a chip and heat spreader presents the single largest barrier to heat flow in the packaging of high-power dissipation devices. The selection of a suitable material to fill the interface between a chip and a heat spreader is critical to the performance and reliability of the semiconductor device. For this reason, there has been continuous effort to develop new thermal interface technologies.
BCC has published a report on the market for all types of thermal management technologies (SMC024F The Market for Thermal Management Technologies, now in its sixth edition). However, BCC believes that the importance of TIM materials and the high rate of innovation merit more detailed analysis in a report of their own.
STUDY GOALS AND OBJECTIVES
The goal of this report is to provide an up-to-date analysis of recent developments and current trends in the global TIM materials market. Specific objectives include:
- Identifying TIM technologies and products with the greatest commercial potential in the near to mid-term (2010–2016).
- Analyzing the key drivers and constraints that will shape the market for TIM technologies over the next 5 years.
- Estimating the current and future demand for TIM technologies and products.
Ascertaining which companies are best positioned to meet this demand, because of proprietary technologies, strategic alliances, or other advantages.
INTENDED AUDIENCE
This report is intended especially for suppliers of TIM and others with a need to understand the status and dynamics of the market for these products. Although the report is organized around specific technologies, it is largely nontechnical in nature and coverage. That is, it is concerned less with theory and jargon than with what works, and how much of the latter the market is likely to purchase, and at what price.
As such, the report’s main audience is executive management, business development, marketing departments, and financial analysts. It is not written specifically for scientists and technologists, although its findings measure and analyze the market for their work, including the availability of government and corporate research funding for different technologies and applications.
SCOPE AND FORMAT OF REPORT
The report addresses the global market for thermal interface materials products during the period from 2010 through 2016, including:
- Thermal greases
- Thermal compounds
- Thermal pads
- Adhesive films and tapes
- Epoxies
- Phase-change materials
- Metal-based TIM.
The report format includes the following major elements:
- Executive summary
- Overview of TIM
- TIM technologies and products
- Applications and end users
- Developers and suppliers
- Market estimates and projections
- Industry structure and competition
- Patent analysis.
The geographic scope for this report is the global market.
INFORMATION SOURCES AND METHODOLOGY
The findings and conclusions of this report are based on information gathered using both primary and secondary research methodologies from a variety of sources. The primary sources of information were Internet searches and industry association data, and interviews conducted with thermal interface material suppliers, custom engineering companies, and manufacturers of representative applications. In addition, other secondary sources were consulted for the report, including industry journals and publications, product literature, white papers and technical journals, and financial reports for industry suppliers.
The base-year for analysis and projection is 2010. With 2010 as a baseline, market projections were developed for 2011 to 2016. These projections are based on a combination of a consensus among the primary contacts combined with BCC’s understanding of the key market drivers and their impact from a historical and analytical perspective. The analytical methodologies used to generate the market estimates are described in detail in the market analysis.
All dollar projections presented in this report are in 2010 constant dollars.
ANALYST CREDENTIALS
Mr. McWilliams, who is the author responsible for this update, is a partner in the Boston-based international technology and marketing consulting firm, 43rd Parallel LLC. Mr. McWilliams is the author of several other Business Communications Co. reports related to thermal management, semiconductors, and electronic products, including SMC024F The Market for Thermal Management Technologies; IFT061A Enabling Technologies for High-performance Computing; SMC065A Analog and Mixed Signal Devices; IFT054A Data Storage Media: Materials, Technologies, Markets; IFT049A Digital Image Sensing, Storage and Transfer; SMC048A Semiconductor Microlithography: Materials and Markets; SMC064B Semiconductor/Microelectronics Cleaning; and IFT066A Printed Electronics: The Global Market.
BCC ONLINE SERVICES
BCC offers an online information retrieval service. BCC’s home page, located at www.bccresearch.com, enables readers to:
- Examine BCC’s complete catalog of Market Research Reports and place direct orders
- Subscribe to any of BCC’s many industry newsletters
- Read announcements of recently published reports and newly launched newsletters
- Register for BCC’s well-known conferences
- Request additional information on any BCC product
- Take advantage of special offers.
DISCLAIMER
The information developed in this report is intended to be as reliable as possible at the time of publication and of a professional nature. This information does not constitute managerial, legal, or accounting advice; nor should it serve as a corporate policy guide, laboratory manual, or an endorsement of any product, as much of the information is speculative in nature. The authors assume no responsibility for any loss or damage that might result from reliance on the reported information or its use.
