Plastics in Electronics Components: Technologies and Global Markets
The global electronic component market volume was 3.6 billion pounds in 2014. This market should reach nearly 3.8 billion pounds in 2015 and more than 4.4 billion pounds by 2020, demonstrating a compound annual growth rate (CAGR) of 3.3% from 2015 to 2020.
- An overview of the global market for plastics in electronic components.
- Analyses of global market trends, with data from 2014, estimates for 2015, and projections of compound annual growth rates (CAGRs) through 2020.
- Information about pricing of resins, molders of electronic components, testing agencies and requirements related to electronic components.
- Discussion of emerging and developmental technologies and applications that have the greatest commercial potential through 2020.
- Coverage of single devices such as connectors, capacitors, switches, bobbins, multiple-component devices such as printed circuit boards and interconnects, and encapsulants.
- Comprehensive company profiles of major players in the industry.
SCOPE AND FORMAT
This study covers all electronic components where plastics are used to a significant extent. It concentrates on components produced by injection molding, compression molding and encapsulation. It does not cover wire and cable, films used in capacitors or recording media, or enclosures.
The study also identifies major material suppliers and key processors. It reviews important new technologies, as well as changes in legislation and industry standards and norms that may have significant effects on markets for electronic components, and it looks at interpolymer competition.
Research analyst Peter Mapleston has been working in and with the plastics industry for 38 years. Since 1983, he has written for some of the world’s leading publications in the sector, covering developments in materials, equipment, processing technologies and markets. He holds a Bachelor of Science degree in polymer science and technology.