AI TECHNOLOGY INC.

Company Snapshot

Founded: 1981
Entity Type: Private
Region: U.S.
Headquarter: New Jersey, U.S.
Key Geographics: North America, Asia-Pacific
Corporate Address: 70 Washington Road Princeton Junction New Jersey 08550 U.S. Tel. +1-609-799-9388 www.aitechnology.com

Company Overview

AI Technology Inc. is a pioneer of flexible epoxy paste and film adhesive technology for electronics packaging. The company has patented numerous applications of advanced materials and adhesive solutions for electronic interconnection and packaging. In addition to providing adhesive solutions both for military and commercial applications, the firm also provides bonding solutions for components. A number of its thermal interface materials, including phase-change thermal pads, thermal grease, thermal gels and thermal adhesives, are industry benchmarks in performance and reliability for power semiconductors, computer systems and communication circuitry. The firm’s COOL-PAD product, a real phase-change thermal interface, has become a standard product of choice for computer, power supply and component manufacturers. The company’s other thermal management products include COOL-GREASE thermal grease.

AI TECHNOLOGY INC. In Reports

The Market for Thermal Management Technologies

Discover the comprehensive analysis of the Thermal Management Market, focusing on technologies and materials. Unveil the market size and key trends to make informed decisions.

Thermal Interface Materials: Technologies, Applications and Global Markets

BCC Research Market Report says global market for thermal interface materials is estimated to increase from $3.9 billion in 2023 to reach $6.8 billion by 2028, at a CAGR of 11.5%.

The Market for Thermal Management Technologies

Global market for thermal management technologies should grow from $14.5 billion in 2021 to $20.9 billion by 2026 with a CAGR of 7.6% for 2021-2026.

Company's Business Segments

  • Material and Adhesive Solutions : The company provides advanced material and adhesive solutions for microelectronic packaging and thermal management applications.

Applications/End User Industries

  • Electronics
  • Automotive
  • Renewable energy
  • Aerospace
  • Military
  • Semiconductors
AI Sentiment