Intel Corp.
History
| Year | Detail |
|---|---|
| 1968 | Intel was established. |
| 1966 | Intel released its first product, the 3101 Schottky random-access memory. |
| 1966 | Intel released the 1101 static random-access memory. |
| 1970 | Intel made first memory system MU-10. |
| 1971 | Intel's First Company-Owned Facility in Santa Clara. |
| 1972 | Intel begins to convert from manufacturing 50mm (2-inch) chip wafers to 75mm (3-inch) wafers. |
| 1974 | Intel opens its first design and development center outside the U.S., in Haifa, Israel. |
| 1974 | Intel opened an assembly facility in Manila, Philippines. |
| 1976 | Intel's first fabrication site outside of California opened in Aloha, Oregon. |
| 1977 | Intel began making magnetic bubble memories through a new subsidiary called Intel Magnetics. |
| 1980 | Intel introduced the 8051 microcontroller family. |
| 1984 | Intel created an entire company division dedicated to supercomputing. Originally called the Scientific Computing Division, in 1992 the division's name was changed to Intel Supercomputing Systems. |
| 1985 | Intel began operations in Jerusalem, Israel. |
| 1993 | Intel released Pentium, its fifth-generation x86 chip and the first Intel processor. |
| 1993 | Intel introduced the Peripheral Component Interconnect (PCI) bus. |
| 1994 | Intel introduced ProShare videoconferencing technology. |
| 1994 | Intel launched its first LANDesk products. |
| 1995 | Intel introduced the higher end Pentium Pro Processor. |
| 1998 | Intel introduced Celeron, a budget-friendly variation of Pentium II. |
| 1998 | The company and other industry leaders established the "Bluetooth" wireless specification. |
| 2000 | Intel launched the next generation Pentium 4. |
| 2001 | Intel and Hewlett-Packard unveiled their jointly designed high-performance processor. |
| 2003 | Intel unveiled the first products to use Centrino Mobile technology. |
| 2004 | Intel announced the world's first NOR flash memory device on 90nm (90-billionths of a meter) manufacturing technology. |
| 2006 | A new logo the company's biggest branding change since 1969 . |
| 2007 | The animated feature film "Ratatouille" was rendered entirely with Intel Xeon processors using Intel Core microarchitecture. |
| 2008 | Intel introduces desktop processor, the Core i7 line. |
| 2009 | Intel introduced the Xeon 5500 processor family for commercial and scientific computing. |
| 2010 | Intel introduced its 310 Solid State Drive (SSD) storage device. |
| 2013 | Intel became the official technology partner of FC Barcelona. |
| 2014 | Intel introduced the Core M processor, the company's second generation of Core processor to use trigate technology and the first to use its new 14 nanometer technology. |
| 2014 | The company formed a new business group dedicated to providing the processors and data center infrastructure for the Internet of Things. |
| 2015 | Intel set a Guinness World Record for "most unmanned aerial vehicles airborne simultaneously” on Nov. 4 when it flew 100 UAVs simultaneously in Hamburg, Germany. |
| 2015 | Intel merged with Altera Corp. in a deal valued at more than $16 billion. |
| 2016 | Intel announced the launch of the Falcon 8+, its first drone for the commercial market. |
| 2017 | At the Los Angeles Auto Show, Intel announced a collaboration with Warner Bros. to develop in-cabin, immersive experiences for cars that would allow people to have virtual adventures. |
| 2017 | Intel and Mobileye reached an agreement to merge in a deal valued at over $15 billion. |
| 2019 | Intel, the Department of Energy, Argonne National Laboratory and computer manufacturer Gray agreed to cooperate on the U.S.’ first exascale system, Aurora with Intel. |
| 2020 | Intel revealed the Lenovo ThinkPad X1 FOLD, the first commercial device with a foldable screen. |
| 2022 | Intel signed a $30 billion partnership with Brookfield Asset Management. |
| 2023 | Intel unveiled Gaudi3, an artificial intelligence (AI) chip for generative AI software which will launch in 2024 and compete with rival chips from Nvidia and AMD. |
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