| Semiconductor Machinery Manufacturing (MFG067B) |
| SPTS |
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Sigma PVD: The SPTS Sigma PVD system accommodates wafer sizes ranging from 100mm to 300mm. Moreover, the fxP cluster platform enables the incorporation of various pre-treatment and deposition technologies, tailored to meet precise process demands.
Delta PECVD: The Delta fxP cluster system provides an extensive array of procedures suitable for diverse dielectric films, covering deposition temperatures spanning from 80°C to 400°C. It includes choices for single or multi-wafer preheating chambers to address de-gassing concerns with sensitive substrates, along with the ability to handle edge contact processing for wafer backside deposition.`
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| MVD |
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MVD100E: The MVD100E system offers multiple features such as single substrate or small batch processing, 200mm wafers, components on trays or racks, small chamber volume for fast processing, and top opening for ease of maintenance and cleaning among others.
MVD300/300E: The MVD300 molecular vapor deposition system (and the MVD300E system, featuring an EFEM for complete automation) are made to offer high-performance, flexibility, and reliability. Also, specifically built for the rigorous demands of high-volume manufacturing applications.
MVD4500: The MVD4500 molecular vapor deposition system serves as a specialized tool for panels and large substrates in the MVD process. This process facilitates the development of ultra-thin organic and inorganic films, catering to applications that demand moisture barriers, anti-corrosion coatings, or release layers for imprinting.
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| Surfscan |
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Surfscan SP7XP: This is a wafer inspection system that identifies defects and surface quality issues that affect the performance and reliability of leading-edge logic and memory devices. It supports IC, OEM, materials, and substrate manufacturing by qualifying and monitoring tools, processes and materials, including those used for EUV lithography.
Surfscan SP Ax: The Surfscan SP A2 and Surfscan SP A3 unpatterned wafer inspection systems identify defects and wafer surface quality issues that affect the performance and reliability of chips manufactured for the automotive, IoT, 5G, consumer electronics, and industrial (military, aerospace, medical) applications.
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