MEIKO ELECTRONICS Co. Ltd.

Products

Category

Product

Brand

Description

Printed Circuit Boards (SMC103D)

HDI PCB (M-VIA I/II)		HDI PCBs are made using laser and plating technologies to stack multiple layers with conductor patterns. It is composed of staggered via and stacked vias. It support any combination with laser via, inner via hole (IVH) or plated through hole (PTH).
AnyLayer PCB (M-VIA III)		AnyLayer PCBs utilize laser and filled plating technology to allow for unrestricted connections between all layers. It support laser via and filled plating on each layer supporting thinner 0.4mm pitch CSP (chip size package) interconnection.
High Layer Count PCB		The technology of high alignment accuracy as well as applying multi-stacked HDI technology, the high-density multi-layer structure is tailored to customer’s requirements.

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