| PCB |
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Conventional PCB,
HDI PCB,
Flex/rigid-flex PCB,
RF and Microwave PCB,
Substrate-like PCB (SLP) |
| PCB |
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Conventional PCBs Capabilities:
Multi-layer up to 60+ layers.,
Lead-free laminates.,
Mixed dielectric (hybrid) constructions.,
Embedded coin or metal core and metal-backed MLB.,
RF and microwave circuits.,
Embedded, distributed, and discrete passive components.
Flex and rigid-flex PCBs Capabilities:
Type 1: Single-sided flexible material with or without a shield.,
Type 2: Double-sided flexible material with or without shield with plated through holes.,
Type 3: Multi-layer flexible material with or without shield with plated through holes and HDI.,
Type 4: Multi-layer rigid and flexible material combinations with plated through holes and HDI.
HDI (high-density interconnect) PCBs Capabilities:
Standard or first-generation microvia.,
Stacked microvia (SMV).,
Deep microvia (DpMV).,
Deep-stacked microvia (DpSMV).
Any layer HDI.
RF and microwave PCBs Capabilities:
Surface finishes.,
Embedded capabilities.,
Thermal solutions,
Back drill for precision-stub removal.
Substrate-like PCB (SLP)
It is a next-generation semiconductor packaging solutions that include HyperBGA and CoreEZ semiconductor package, |
