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HDI Features:-
Suitable for BGA with smaller ball pitch and higher I/O counts,
Fine line, micro via and registration technologies capable of 0.3 mm ball pitch Increase routing density in complicated design,
Thin board capability, copper filled via and excellent mounting stability and reliability,
Lower Dk / Df material enables better signal transmission performance (ex: 5G products),
Low CTE & High Tg material fulfills high-reliability demand.
ELIC Features:-
Every layer via structure to achieve miniature design,
Copper filled via provides better reliability,
Superior electrical characteristics.
Multi-Layer PCB Features:-
From 2 to 68 layers,
Supports fine line & narrow pitch CSP mounting,
Hybrid materials such as high-speed and high-frequency lamination.,
Multiple back drill,
Product design combines the High-Density Interconnect (HDI) and High Layer Count (HLC) Technology.
Rigid Flex PCB Features:-
Combination of rigid and flex PCB.,
It is used in mobile phone, battery module, wearable module, LCD module, camera module, and SSD.
Soft PCB (FPC) Features:-
Used for board-to-board connection function.,
It is flexible and space-saving, can break through the limitations of mechanical design, and supports dynamic applications.,
Provide SMT loading service for one-time purchase.,
It has a complete product line and can produce single-panel, double-panel and multi-layer boards. |
