| Printed Circuit Boards: Technologies and Global Markets (SMC103D) |
| FPC |
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Product Feature
Flexible, bendable and foldable, facilitate the assembly of electrical components.,
Lightweight and thin, in line with the trend of light, thin, miniaturized mobile electronic equipment.,
LCP antenna meets high-frequency and high-speed transmission requirements in the 5G era. |
| SLP |
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Product Feature
The mSAP process can produce extremely detailed circuits, between HDI and IC carrier board.,
Thinner and smaller size suits the compact design for new-generation consumer electronics.,
Good reliability. |
| HDI |
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Product Feature
Small, high-density circuit distribution and high transmission efficiency.,
The design of blind holes and buried holes makes the product occupy a small space, which is in line with the trend of light, thin, miniaturized mobile electronic equipment.,
Variety of stacks, diverse selection of raw materials, development towards high-end multi-layer and Anylayer. |
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