DISCO CORP.

DFD6240: It offers consistent and dependable cut quality through the new Synchro Spindle for radial rigidity. The cutting water flow rate controller, programmable via the touch-panel display, sets the flow rate for each process recipe. DFD6341: It is the fully automatic dual spindle dicing saw for Φ8-inch wafers, incorporating the throughput enhancement technology developed in DFD6362 for Φ300 mm wafers. DFD6341: It is the fully automatic dual spindle dicing saw for Φ8-inch wafers, incorporating the throughput enhancement technology developed in DFD6362 for Φ300 mm wafers.

DFL7160: It is a fully automatic laser saw for Φ300 mm wafers which uses a pulse laser to achieve non-thermal processing. DFL7341: It is a fully automatic laser saw for Φ8-inch wafers which has seen wide used in applications such as LED sapphire substrates and silicon microphones. DFL7362: It is a fully automatic laser saw for Φ300 mm wafers used mainly to singulate ultra-thin Si wafers.

DAW4110: It can cut inner corners with a radius, R, of 0.3 mm by achieving a 0.3 mm kerf width using the waterjet saw. Thus, the equipment is suitable for processing narrow sections.