DISCO CORP.
Company Snapshot
Company Overview
DISCO Corporation manufactures industrial machinery for grinding and cutting. The company offers various products including dicing saws, laser saws, grinders, polishers, wafer mounter, die separator, and surface planer among others. Further, precision processing equipment segment caters to multiple applications such as wafer manufacturing, optical semiconductors, package singulation, non-semiconductors, and integrate circuits (ICs) among others.
DISCO Corporation operates in multiple regions such as North America, Asia-Pacific, and Europe. Further, country-wise, the company operates across Japan, Singapore, Taiwan, South Korea, China, and many more. Also, the company has four reportable segments namely precision processing equipment, precision processing tools, maintenance parts, others, and industrial products with precision processing equipment generating higher revenue.
Financial Highlights (FY 2024)
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Company's Business Segments
- Product : Dicing Saw, Laser Saw, WaterJet Saw, Surface Grinder, Polisher, Surface Planer, Wafer Mounter, Die Separator, Others
- Service : Training Services, After-Sales Service, Troubleshooting and FAQs for Precision Processing Equipment, Trouble Support, Others
Applications/End User Industries
- Semiconductor
- Electronics
- Automotive
- Telecommunications