| Semiconductor Machinery Manufacturing (MFG067B) |
| Ball Bonder |
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POWERCOMM: Advanced Wire Bonder for Discrete Devices. Key features include bondable area of 56 mm x 87 mm, novel proprietary quick suite provides robust process performance at maximum UPH, and an illumination system with automatic adjustment for PRS robustness.,
POWERNEXX: It enhances auto SHTL and NSOL recovery for improved MTBA performance and offers minimum crosshair offset of 4mm to improve lookahead function.,
ULTRALUX: It comes with the advanced close-loop servo with lower mass higher stiffness XYZ enhanced design.,
RAPID Pro: It is an automatic wire bonder enabling industry 4.0 communication.,
RAPID MEM: It offers advanced process capabilities, real-time monitoring, and diagnostics to ensure the best quality and efficient assembly serving high-performance and high-reliability semiconductor applications.,
RAPID: It offers real-time process and performance monitoring, real-time equipment health monitoring, and advanced data analytics and traceability.,
ConnX ELITE Opto: It has an. updated motion control system and the quick-LED suite processes deliver maximum productivity and simplified process optimization. |
| Die Attach |
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ISTACK W+: It offers high accuracy kit (5 μm), mapping functions (Substrate / Wafer), and wafer/substrate contamination removal kit, and OHT / AGV kit.,
ISTACK S+: The iStack S+ is designed for high-end epoxy and film die attach applications with process flexibility to support both the memory and image applications. |
| Lithography |
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LITEQ 500 SYSTEM: LITEQ 500 is a lithography solution dedicated for advanced packaging with a lower cost-of-ownership designed to meet the demands of 2.5/3D, Wafer-level packaging, Fan-in, Fan-out, Flip Chip, and relevant applications such as MEMS, LED, CIS, RF, mobile processor, and CPU/GPU. |
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