Kulicke and Soffa Industries Inc.

Company Snapshot

Founded: 1951
Entity Type: Public
Employees: 2,746
Region: China
Revenue: $706.2 Millions
Revenue Year: 2024
Headquarter: Serangoon, Singapore
Key Geographics: U.S., China, Taiwan, Malaysia, Japan, Philippines, Korea, Hong Kong, Other Countries
Corporate Address: 23A Serangoon North Avenue 5 #01-01 554369 Singapore Tel. +65-6880-9600 www.kns.com

Company Overview

Kulicke and Soffa Industries, Inc is a Singapore based company that specializes in developing semiconductor and electronics assembly solutions. The company offers products and services across multiple industries such as advanced display, automotive, communications, compute, consumer, data storage, energy storage and industrial.

Also, the company designs and develops capital equipment and consumables and provides services used to assemble semiconductors and electronic devices, such as integrated circuits, power discretes, light-emitting diode, advanced displays and sensors. Company’s customers primarily consist of integrated device manufacturers, outsourced semiconductor assembly and test providers, foundry service providers, and other electronics manufacturers and automotive electronics suppliers.

Additionally, the company operates across the multiple geographies including U.S., China, South Korea, Taiwan, Japan, Malaysia, Philippines, and Hong Kong among others.

Financial Highlights (FY 2024)

Net Revenue: ***
Total Current Liabilities: ***
Total Current Assets: ***
R&D expenses: ***
Operating Income: ***

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Kulicke and Soffa Industries Inc. In Reports

Semiconductor Machinery Manufacturing: Global Markets

BCC Research Market Analyst says global market for semiconductor machinery manufacturing is expected to grow from $121.5 billion in 2024 and is projected to reach $223.8 billion by the end of 2029 at a CAGR of 13.0%.

Company's Business Segments

  • Ball Bonding Equipment : This represents the company's results from the design, development, manufacture, and sale of ball bonding equipment and wafer-level bonding equipment.
  • Wedge Bonding Equipment : It reflects the company's results from designing, developing, manufacturing, and selling wedge and wedge-related bonding equipment.
  • Advanced Solutions : It reflects the company's results from designing, developing, manufacturing, and selling advanced display, die-attach, and thermocompression systems and solutions.
  • APS : It reflects the company's results from the design, development, manufacture, and sale of various tools, spares, and services for our equipment.

Applications/End User Industries

  • Automotive
  • Communications
  • Consumers
  • Data Processing
  • Industrial
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