SUMCO CORP.

SUMCO's highly polished wafers are the substrate materials for the manufacture of advanced semiconductor devices. Their extremely flat and smooth surfaces are established by precise polishing to have few surface defects and particle contamination. Offered in different diameters, such as 200mm and 300mm, these wafers possess high geometry, flatness and contamination levels conforming to rigorous industry standards, which suit their use in applying logic ICs, memory chips and discrete devices.

Annealed wafers provided by SUMCO are heat-treated at high temperatures to remove stress and increase crystalline quality. The treatment raises mechanical strength and suppresses defect generation during device processing. These wafers are particularly suitable for next-generation CMOS applications, power semiconductor devices and RF components where structural stability and high purity are of utmost importance.

Its epitaxial wafers consist of a monocrystalline silicon layer deposited over a polished wafer surface via chemical vapor deposition (CVD). The epitaxial layer provides better doping profile control and crystal integrity, which improves device performance. Epi wafers have extensive applications in power electronics, high-voltage devices and CMOS logic because it possess very good junction isolation, lower leakage and higher breakdown voltage.