Taiwan Semiconductor Manufacturing Co. Ltd.

Company Snapshot

Founded: 1987
Entity Type: Public
Employees: 90,557
Region: U.S.
Revenue: $121,423.5 Millions
Revenue Year: 2025
Headquarter: Taiwan, Republic of China
Key Geographics: Taiwan, U.S., China, Japan, Others, Europe, Middle East and Africa
Corporate Address: 8, Li-Hsin Rd. 6, Hsinchu Science Park, Hsinchu 300-096, Taiwan, Republic Of China Tel. +886-3-5636688 www.tsmc.com

Company Overview

Taiwan Semiconductor Manufacturing Co. Ltd. (TSMC) is an IC foundry. It served 522 customers in 2024 while producing 11,900 products, including HPC, smartphones, IoT, automotive, and consumer electronics. It built its advanced manufacturing capabilities to produce about 17 million 12-inch wafers through its worldwide network of fabrication plants in Taiwan and China, the U.S., and Japan, and its future factories in Germany.

TSMC’s advanced packaging portfolio, which includes its 3DFabric platform with SoIC, CoWoS, and InFO technologies, enables the design of complete systems using mini chips that employ different technologies.

Financial Highlights (FY 2025)

Net Revenue: ***
Total Current Liabilities: ***
Total Current Assets: ***
R&D expenses: ***
Operating Income: ***

This information is available for BCC Research members only.

Taiwan Semiconductor Manufacturing Co. Ltd. In Reports

Advanced Chip Packaging Technologies: Global Market

BCC Research detailed report on Advanced Chip Packaging Market scenarios 2024 is considered a base year, 2025 is an estimated year, and market values are forecasted for five years until 2030.

Semiconductor Chips: Applications and Impact of Shortage

BCC Research detailed report on semiconductor chip market players' products and strategies Using 2024 as the base year the report provides estimated market data for 2025 through 2030.

Global Chiplets Market

BCC Research Report: Dive into Chiplets Market report, 2023 will be considered a base year, 2024 will be the estimated year, and the market values will be forecasted for five years until 2029.

Company's Business Segments

  • Wafer : Wafer, Others. 12-inch wafer GIGAFAB® fabs, four 8-inch wafer fabs, and one 6-inch wafer fab
  • Others : CyberShuttle, MaCyberShuttle, Mask Services, eFoundry, Advanced Packaging, TSMC University FinFET Program.

Applications/End User Industries

  • High Performance Computing industries
  • Digital and Electronics industries
  • Automotive Industries
  • Smartphone industries
AI Sentiment