Global Market for Mixed-signal System-on-Chip Applications with a Focus on Node Geometries
This report on Mixed-signal System-on-Chip (SoC) Applications highlights the factors that drive or inhibit the growth of the current market for semiconductor and electronics industry, and analyzes the main materials, end uses and growth opportunities that are mainly driven by automotive, security, power management, networking and communication applications. Silicon vendors are focusing on node geometry for high performance mixed-signal designs. BCC Research analyzed strong driving forces to boost the development and concepts behind the node geometry of mixed-signal SoC in order to facilitate a better understanding of current and future applications and forecasted market growth.
- An overview of the global market for mixed-signal SoC applications and a detailed study on node geometries
- Analyses of global market trends, with data from 2018, estimates for 2019, and projections of compound annual growth rates (CAGRs) through 2024
- Characterization and quantification of SoC application market by design, technology node, application and region
- Comparative study on digital vs manual signals
- Detailed information about the major factors influencing the market growth and recent developments within the industry
- Company profiles of the leading players in the industry, including Broadcom Corp., Intel Corp., Micron Technology Inc., Qualcomm Inc., Taiwan Semiconductor, and Toshiba Corp.
Research Analyst Sinha G. Gaurav holds an MBA in finance from ICFAI Business School, Hyderabad (India), and a bachelor's degree in electrical engineering from Rajasthan University (India). His primary focus is in the electronics and semiconductor markets. He has nine years of experience in the field of market research in electronics, finance and database designing. His areas of interest include semiconductors, automation, industrial controls, robotics and nanotechnology. His publications focus on subjects such as quantum dots, photonic sensors and detectors, LIDAR, ultrafast lasers, home automation, helmet-mounted displays (HMDs), factory automation and radio frequency (RF) components, among others.