Global Semiconductor Silicon Wafer Market

Nov 2019| SMC112A| BCC Publishing

Report Highlights

The global market for semiconductor wafers should grow from $16.2 billion in 2018 to $21.3 billion by 2023 with a compound annual growth rate (CAGR) of 5.7% for the period of 2018-2023.

Report Includes

  • 72 data tables and 10 additional tables
  • An overview of the global markets for semiconductor silicon wafers
  • Analyses of global market trends, with data from 2017, 2018, and projections of compound annual growth rates (CAGRs) through 2023
  • Identification of potential applications of semiconductor silicon wafers in consumer electronics, telecommunications, automotive, defence, and healthcare industry
  • Overview of various bonding technologies in the semiconductor silicon wafers industry, including direct bonding, surface activated bonding, plasma activated bonding and anodic bonding
  • Coverage of major innovation initiatives in silicon wafer fabrication technology
  • Detailed analysis of major vendors and suppliers of the industry, including 3M, Global Wafers Co., Ltd., Mechatronik Systemtechnik GmbH, Nissan Chemical Corporation, Samsung, Shanghai Simgui Technology, Toshiba and Wafer World Inc

Report Scope

This report forecasts the market for compound semiconductor wafers for 2018-2023. The report presents the market forecast in terms of dollar value ($ million) and shipment volume (msi).

Dollar value and shipment volume are broken down along the following end uses:

  • Telecommunications.
  • Instrumentation and scientific research.
  • Healthcare.
  • Energy, defense and surveillance.
  • Computing and entertainment.
  • Industrial and automotive.
  • Retail and others.

Each of the end applications is further broken down by crystal growth methods:

  • Bridgman and allied methods (Bridgman).
  • Float-zone (FZ).
  • Czochralski (CZ) and allied methods (Czochralski).

Each end application is broken down by the following wafer-bonding methods:

  • Direct bonding.
  • Surface-activated bonding.
  • Anodic bonding.
  • Plasma bonding.

Each end application is further broken down by node size:

  • 10 nm and lower.
  • 12 to 22 nm.
  • 28 nm and above.

Each end-application is further broken down by regional market:

  • Americas.
  • Europe, Middle East and Africa (EMEA).
  • Asia Pacific (APAC).

Analyst Credentials

Shalini Ramamurthy has extensive experience analyzing and evaluating advanced information technology, including telecommunications and optical networks. She holds a Bachelor of Engineering degree in Electronics and Telecommunications from Kumaraguru College of Technology in Coimbatore, India, as well as a Master of Science degree in Telecommunications and Software Engineering from the Illinois Institute of Technology in Chicago.

Table of Contents & Pricing

All reports provided in PDF format. For shared licensing options (5+ Users), please call a representative at (+1) 781-489-7301 or contact us at
Title/Chapter NamePagesPrice Member Price
Full Report: Global Semiconductor Silicon Wafer Market163 $2,500 Free
Chapter- 1: Introduction6Free
Chapter- 2: Executive Summary3$250Free
Chapter- 3: Semiconductor Device Manufacturing and Material Properties17$261Free
Chapter- 4: Crystal Growth Methods8$123Free
Chapter- 5: Wafer-Bonding Process8$123Free
Chapter- 6: Node Sizes11$169Free
Chapter- 7: Regional Markets7$107Free
Chapter- 8: Global Markets49$752Free
Chapter- 9: Patent Analysis 18$276Free
Chapter- 10: Company Profiles36$552Free
Global Semiconductor Silicon Wafer Market

Single User License: $2500

Become a Member

Already a member? Login to access this report free.

Have a Question? Ask Us.

Why BCC Research.?

Every purchase provides access to:

  • Thousands of recently published reports from select publishers
  • Member Discounts of up to 50% on over 20,000 additional reports from all publishers
  • Our analysts and research concierge for all inquiries