Press Releases

New Thermal Management Techs Moving Global Market (6% CAGR)

August 31, 2017

Additional Reports

Wellesley, Mass., Aug 31, 2017—The past few years have seen tremendous growth both in technology and in demand for electronic devices and systems. The technological progress primarily has arrived on two main fronts: increased functionality and miniaturization, developments which are keying 6.0% CAGR in the global market for thermal management products, says Thermal Management Technologies for Semiconductor Microchips.

The August BCC Research report estimates the global market for hardware for thermal management in microchips will grow from nearly $4.7 billion in 2017 to $6.3 billion by 2022.By the end year of the forecast period, fans and blowers are expected to maintain its segment lead with 33.4% of the market, followed by heat sinks with 32.7% and, heat pipes with 23.0%.

As a result of the widespread introduction of microelectronics, coupled with the increasing demands due to their functionality and reliability, thermal management has become an important issue in almost every branch of industry, including professional and consumer electronics systems as well as automobile electronics, electronic lamps, and domestic appliances. The trend towards greater power dissipation has pushed the development of thermal management devices and strategies as engineers sought to remove enough heat from the device to ensure that circuit components stayed below the levels needed to retain the performance and reliability of the system.

Research Highlights

  • The Asia-Pacific region is projected as the fastest-growing major market, with a 6.6% CAGR.
  • Computers captured about 30% of the market for heat sinks, a segment estimated to achieve a 7.2% CAGR during the forecast period.
  • The move to lead-free products may cause some volume assemblers to move to the more expensive thermal management techniques and to use clips and interfaces to attach heat sinks.

"While the performance-heat-dissipation curve of the latest chips may have begun to flatten out when compared to the old trends, the end is nowhere in sight," says BCC Research analyst, Aneesh Kumar, who authored the report. “The ‘Steeper’ research project aimed to eliminate processor power consumption almost entirely when chips are in standby mode, as well as to cut power usage by 10 times when in use. Meanwhile, manufacturers employ thermal management technologies to increase the life of the components in their electronic systems. According to engineers, such technologies shall aid in reducing the temperature of electronic components by 10°C, which will double their life-span.”

Editors and reporters who wish to speak with the analyst should contact Steven Cumming at steven.cumming@bccresearch.com.

Thermal Management Technologies for Semiconductor Microchips( SMC106A )
Publish Date: Aug 2017    

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