Amkor Technology

Company Overview

Amkor Technology is the U.S.-headquartered provider of OSAT services. It provides advanced packaging technologies that enable it to serve high-demand markets, including AI and data centers, 5G technology, and electric vehicles. It offers multiple manufacturing capabilities, including wafer bumping, packaging, and system testing. Amkor provides packaging solutions, including laminate and leadframe packaging, memory, MEMS and sensor packaging, power packaging, System-in-Package (SiP), wafer-level packaging (WLCSP, WLFO/WLCSP+, WLSiP/WL3D), along with advanced technologies such as S-Connect embedded silicon bridge interposer and S-SWIFT for chiplet and memory integration, as well as test services.

Amkor Technology serves various IDMs, fabless firms, OEMs, and foundries worldwide. Amkor operates facilities throughout Asia-Pacific, Europe, and the U.S. to deliver both its technological capabilities and high-volume production capacity.

Financial Highlights (FY 2025)

Company's Business Segments

• Semiconductor IC Packaging and Test Services : The company provides outsourced semiconductor packaging and testing services, including design, assembly, and testing. Also, it serves as a manufacturing partner for the world’s leading semiconductor companies, foundries, and electronics original equipment manufacturers (OEMs).