Amkor Technology

Company Overview

Amkor Technology is the largest independent supplier of outsourced packaging and test semiconductor interconnect services. The company offers more than 850 different package formats and sizes, from traditional lead-frame packages for through-hole and surface mounting to the latest chip-scale and ball grid array solutions required in high-pin-count and high-density applications. This broad product family allows Amkor to be a single source for many of its customers’ total IC packaging requirements. Amkor’s relevance to this report results from its foray in the thermal substrate market as a niche provider. It’s more efficient to use BGAs than lead frames because they have lower thermal resistance, inductance and interconnection density. Plastic or tape laminate substrates are applied over a lead frame substrate. In this package, the electrical connections are on the bottom rather than around the perimeter.

Financial Highlights (FY 2024)

Company's Business Segments

• Semiconductor IC Packaging and Test Services : The company provides outsourced semiconductor packaging and testing services, including design, assembly, and testing. Also, it serves as a manufacturing partner for the world’s leading semiconductor companies, foundries, and electronics original equipment manufacturers (OEMs).