Amkor Technology

History

Year	Detail
1968	Amkor Technology was founded by Joo-Jin (James) Kim and opened its sales office of the semiconductor packaging company in Philadelphia.
2001	Amkor Technology and Toshiba formed a joint venture called Amkor Iwate, a contract semiconductor assembly and test service in Japan. This venture allowed Amkor to enter the Japanese market and establish its contract semiconductor assembly and test leadership.
2002	Amkor Technology Inc. acquired Citizen Watch Co. Ltd.'s semiconductor assembly business to enhance its product offerings in Japan, increase its customer base, and provide additional resources to expand its application development and design services.
2004	Amkor Technology acquired IBM's Singapore test plant, including its test operations, testers, assets, and employees.
2004	The company acquired North Carolina-based Unitive Inc. and a majority interest in Unitive Semiconductor Taiwan Corporation for $48 million. With these acquisitions, Amkor gains industry-leading technology for electroplated wafer bumping and turnkey wafer-level "chip scale" packaging, together with installed and operationally qualified, high-volume 200mm and 300mm electroplated wafer bumping and wafer-level packaging manufacturing operations.
2006	Amkor Joins IBM, Chartered, and Samsung to broaden standard platform technology offerings with package and test solutions for advanced silicon processes.
2009	Amkor Technology established J-Devices in Kyushu, Japan, through a joint venture with Nakaya Microdevices Corporation (NMD) and Toshiba. This venture aimed to provide semiconductor assembly and final testing services in Japan, utilizing Toshiba's existing assembly and test operations.
2012	Amkor Technology and J-Devices acquired two additional semiconductor plants in Japan from Fujitsu Semiconductor. This acquisition was part of Amkor's larger strategy to expand its footprint in Japan.
2013	Amkor Technology and J-Devices acquired three additional semiconductor plants in Japan from Renesas Semiconductor. This acquisition involved the transfer of Renesas' back-end facilities and other assets to J-Devices, following a Memorandum of Understanding signed in January 2013.
2017	The company acquired NANIUM S.A., one of the leading providers of wafer-level fan-out (WLFO) semiconductor packaging solutions. The acquisition will strengthen Amkor's position in the fast-growing market for wafer-level packaging for smartphones, tablets, and other applications.
2023	Amkor announced the development of the U.S. Advanced Packaging and Test facility in Peoria, Arizona, which will enable a resilient domestic semiconductor supply chain.
2024	Amkor Technology and GlobalFoundries partnered to strengthen the European automotive supply chain and expand services for global customers.
2024	Amkor Technology and the U.S. Department of Commerce signed a preliminary memorandum of terms (PMT), according to the National Institute of Standards and Technology, setting the stage for a potential $400 million investment under the CHIPS and Science Act. This investment aims to support Amkor's new advanced packaging and testing facility in Peoria, Arizona.
2024	Amkor Technology and TSMC are expanding their partnership to bring advanced packaging and testing capabilities to Arizona, specifically focusing on a new facility in Peoria, Arizona.