Amkor Technology

Amkor’s ePad LQFP/TQFP packages enhance thermal performance by significantly improving heat dissipation, up to 110% more than standard LQFP/TQFP packages. It is achieved through an exposed pad design that should be soldered directly to the PCB, facilitating better heat transfer and electrical grounding, which also reduces loop inductance for high-frequency applications. Additionally, these packages support 3D packaging with die stack processes, expanding the use in multi-chip solutions. These packaging solutions cater to the needs of compact, high-density electronic designs and are well-suited for applications in automotive systems, LCD/flat-panel TVs, and telecommunications. The grounding capability and improved thermal efficiency make them compatible with high-speed silicon technologies, helping designers meet performance and reliability requirements in power-constrained environments.

These are R&D and package solutions (vapor chambers, metal/graphite/sintered TIMs) for high-power packages and improved thermal spreading.