Benchmark Electronics Inc.
Company Snapshot
Founded: 1979
Entity Type: Public
Employees: 12,000
Region: U.S.
Revenue: $2,656.1 Millions
Revenue Year: 2024
Headquarter: Arizona, U.S.
Key Geographics: U.S., Singapore, Other Asia, Europe, Other Countries
Corporate Address: 56 South Rockford Drive Tempe, Arizona 85288 U.S. Tel. +1-623-300-7000 www.bench.com
Company Overview
Benchmark Electronics Inc. provides electronics manufacturing services by offering customers integrated design and manufacturing services, from initial product design to volume production and direct order fulfillment. The company’s engineering services include product design, PCB layout, prototyping and test development. Benchmark produces PCBs and other electronic subsystems for communications devices (about 40% of sales), computers and medical and testing instruments.
Financial Highlights (FY 2024)
Net Revenue: ***
Total Current Liabilities: ***
Total Current Assets: ***
R&D expenses: ***
Operating Income: ***
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Benchmark Electronics Inc. In News
Company's Business Segments
- Complex Industrials : Microelectronics for Hybrid Assemblies, Complex and Mixed-technology systems
- A&D : RF system design and test development up to 110 GHz, Design of high-density interconnect circuits, Photonics test, Assembly, Packaging, Ruggedized design and ruggedization of Commercial-off-the-Shelf (COTS) parts, Data integration/data interoperability solutions, Custom RF filter development
- Medical : Connected Medical Devices, Energy Delivery Devices, Fluid Management, Radiological Imaging, Medical Robotics, Optical Imaging
- Semi-Cap : Printed Circuit Board Assembly and system-level assembly with high degree vertical integration, Complex precision machining, Electron-beam welding, Custom design engineering solutions for critical subsystems, Sheet metal and frame fabrication, Accelerated Manufacturing Protocol (AMP) for rapid prototyping, Multi-region IP protection, Configure-to-Order solutions, Design for Quality Cost and Manufacturability, Full-system integration and test
- Advanced Computing : Photonics test assembly and packaging, Fiber optic splice polish and assembly, High-speed circuit design, System design and architecture, Advanced thermal management modeling and design engineering, Precision microelectronics assembly, Mixed-technology modules and assemblies, Manufacturing and test processes for novel cryogenic materials for quantum computing, Electronics miniaturization, Test development, Information assurance manufacturing of government computing systems
Applications/End User Industries
- Energy and Utilities
- Automotive
- Industrial Manufacturing
- Aerospace and Defence
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