Plastics in Electronics Components: Technologies and Global Markets
The global electronic component market volume was 3.6 billion pounds in 2014. This market should reach nearly 3.8 billion pounds in 2015 and more than 4.4 billion pounds by 2020, demonstrating a compound annual growth rate (CAGR) of 3.3% from 2015 to 2020.
- An overview of the global market for plastics in electronic components.
- Analyses of global market trends, with data from 2014, estimates for 2015, and projections of compound annual growth rates (CAGRs) through 2020.
- Information about pricing of resins, molders of electronic components, testing agencies and requirements related to electronic components.
- Discussion of emerging and developmental technologies and applications that have the greatest commercial potential through 2020.
- Coverage of single devices such as connectors, capacitors, switches, bobbins, multiple-component devices such as printed circuit boards and interconnects, and encapsulants.
- Comprehensive company profiles of major players in the industry.
SCOPE AND FORMAT
This study covers all electronic components where plastics are used to a significant extent. It concentrates on components produced by injection molding, compression molding and encapsulation. It does not cover wire and cable, films used in capacitors or recording media, or enclosures.
The study also identifies major material suppliers and key processors. It reviews important new technologies, as well as changes in legislation and industry standards and norms that may have significant effects on markets for electronic components, and it looks at interpolymer competition.
Research analyst Peter Mapleston has been working in and with the plastics industry for 38 years. Since 1983, he has written for some of the world’s leading publications in the sector, covering developments in materials, equipment, processing technologies and markets. He holds a Bachelor of Science degree in polymer science and technology.
The global market for resins used in electronic components reached 3.4 billion pounds in 2011. It is expected to reach 3.5 billion pounds in 2012 and it will further grow to 4.4 billion pounds by 2017, a compound annual growth rate (CAGR) of 4.7%.
Thermoplastic and thermoset volumes, estimated at slightly over 586 million pounds in 2006 should reach over 700 million pounds by 2011 corresponding to an annual growth rate of 4.3%.
Thermoplastics will have the highest growth rate through the forecast period at 4.8%. Consumption is almost 400 million pounds in 2006 and should grow to just over 500 million pounds in 2011.
In terms of technology driven factors, miniaturization is still an important factor, although it is beginning to reach its saturation point; thinwalling of molded parts; and higher soldering temperatures due to surface mount technologies (SMT) and lead-free soldering have been some of the key parameters affecting choices and volumes of plastics being used to mold components. These factors will drive the use for resins with higher heat deflection temperatures (HDTs) and glass transition temperatures (Tgs) and lower dielectric constants.
The total annual consumption of plastics in electronic components in North America was just over 415 million pounds in 2001 and will rise at an AAGR (average annual growth rate) of 3.9% to 503 million pounds in 2006.
Thermoplastics account for 65% of the market, and growing at a higher AAGR of 4.8% will take nearly 68% in 2006.
Thermosets will rise at an AAGR of just 2.2% from 145 million pounds to 162 million pounds.
Three specific applications, namely PCB laminates, encapsulation, and connector molding account for more than 80% of total market volume of the market.
Nearly 57% of plastics are consumed in stationary computers and peripherals, a number that will dip slightly by 2006.
The share for portable applications will rise from 7.1% in 2001 to 11.1% in 2006.