Report Highlights
The global market for plastics in electronic components was valued at $16.4 billion in 2025 and is estimated to increase from $17.3 billion in 2026 to reach $23.6 billion by the end of 2031, at a compound annual growth rate (CAGR) of 6.4% from 2026 through 2031.
Report Includes
- 110 data tables and 47 additional tables
- Analysis of the plastics in electronics components market, including current market size and future growth potential
- Market size estimates for 2025 (base year) and forecasts for the period 2026 through 2031
- Detailed segmentation of the market by polymer type, thermosets, application and electronic component type
- Analysis of key market drivers, restraints, and opportunities influencing market growth
- Insights into industry trends, emerging technologies and developments in plastics in electronics components
- Analysis of regional markets, including North America, Europe, Asia-Pacific, South America and Middle East and Africa
- Competitive landscape analysis, including market share, ranking and strategic developments of key players
- Profiles of leading and emerging companies, including their product portfolios, financials, and recent developments
- Company profiles of major players within the industry, including BASF, SABIC, Celanese Corp., Toray Industries Inc., and Mitsubishi Chemical Group Corp.
Report Scope
This report provides a detailed global market analysis of plastics in electronic components, reflecting the latest data, trends, and market projections. Plastics in electronic components are thermoplastic and thermoset polymer materials used as integral functional materials within electronic architectures to enable electrical, thermal, mechanical, dielectric, and environmental performance in modern electronic systems. These plastics are not merely structural or cosmetic materials; rather, they serve as critical enabling materials that directly support the operation, protection, miniaturization, interconnection, insulation, encapsulation, thermal stability, and signal integrity of electronic components. They are incorporated into the internal composition of connectors, printed circuit board (PCB) substrates, semiconductor packaging systems, passive and active electronic components, electromechanical assemblies, sensors, micro-electronics, and thermal-management systems used across advanced electronics applications.The report focuses on the polymer type, component type, and end-use aspects of plastics in electronic components. The base year for the study is 2025, with estimates and forecasts for 2026 through 2031. Market estimates are valued in U.S. dollars (millions). Forecast growth rates are based on expected industry capacity additions, feedback from industry leaders, revenue reported by major companies, and anticipated regulatory updates. Data from major plastics associations—such as Plastics Europe, Plastics Industry Association, the International Council of Chemical Associations, the British Plastics Federation, the Vietnam Plastics Association, the Indian Polyurethane Association, and the China Plastics Processing Industry Association were used to anticipate market dynamics and to further measure market size.
For this analysis, the global market for plastics in electronic components is segmented as follows:
- Polymer type:Thermoplastics and thermosets.
- Thermoplastics: Commodity and engineering plastics, high-performance engineering plastics, and ultra-high-performance plastics.
- Commodity and engineering plastics: Polyamide, PBT/PET, polycarbonate, acrylonitrile butadiene styrene, polyvinyl chloride, polypropylene, polyethylene, and polymethyl methacrylate.
- High-performance engineering plastics: Polyphenylene sulfide, polyetherimide, and sulfone polymers.
- Ultra-high-performance plastics: Fluoropolymers, liquid crystal polymers, and polyetheretherketone.
- Thermosets: Epoxy resins, silicone resins, phenolics, polyurethanes, and unsaturated polyesters.
- Thermoplastics: Commodity and engineering plastics, high-performance engineering plastics, and ultra-high-performance plastics.
- Component Type: Interconnects and connectors, printed circuit boards, active components, passive components, electromechanical components, sensors and micro-electronics, thermal management components, and others (antenna and RF plastic assemblies, optical and photonic electronic components, fuse, and circuit protection components).
- End Use: Consumer electronics, automotive, AI and data centers, industrial, telecom, energy and power, medical, and others (aerospace, defense, smart infrastructure, marine).
- Region: North America, Europe, Asia-Pacific, South America, and the Middle East and Africa.
Report Synopsis
| Report Metrics | Details | ||||||||||||||||
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
| Base year considered | 2025 | ||||||||||||||||
| Forecast period considered | 2026-2031 | ||||||||||||||||
| Base year market size | $16.4 billion | ||||||||||||||||
| Market size forecast | $23.6 billion | ||||||||||||||||
| Growth rate | CAGR of 6.4% for the forecast period of 2026-2031 | ||||||||||||||||
| Units considered | $ Millions | ||||||||||||||||
| Segments covered | By polymer type, component type, end use, and region. | ||||||||||||||||
| Regions covered | North America, Europe, Asia-Pacific, South America, Middle East and Africa | ||||||||||||||||
| Countries covered | U.S., Canada, Mexico, Germany, France, Italy, U.K., Spain, Poland, Russia, the Netherlands, Sweden, Norway, Switzerland, Ireland, Denmark China, Japan, India, South Korea, Australia, Thailand, Singapore, Vietnam, Malaysia, Indonesia, the Philippines, Brazil, Argentina, Chile, Colombia, Paraguay, Peru, U.A.E., Saudi Arabia, South Africa, Egypt, , Israel, Kuwait, Oman, and Bahrain | ||||||||||||||||
| Key Market Drivers |
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| Companies studied |
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Frequently Asked Questions (FAQs)
- AI infrastructure and hyperscale datacenter expansion.
- Surge in 5G, high-frequency electronics and telecom infrastructure.
- Electrification and EV electronics growth.
- Renewable energy and power electronics expansion.
- Key challenges include- Semiconductor and electronics supply-chain volatility; Rising cost of high-performance polymers.
- Key opportunities include- Growth of industrial automation and smart infrastructure; Rising adoption of flexible electronics, wearables and printed electronics.
Analyst Credentials
BCC Research Team possesses expertise and experience in life and physical science domains. They specialize in offering valuable business insights, including industry analysis, competitor intelligence, strategic and financial analysis, and opportunity assessment. The team has in-depth knowledge of various sectors, including healthcare, biotechnology, pharmaceuticals, IT, automation, advanced materials, and energy. They are proficient in qualitative and quantitative market intelligence providing clients with actionable insights. With a vast understanding of the competitive landscape, the team can support clients in making data-driven decisions to help them achieve a competitive edge in their respective markets.
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Report Highlights
The global plastics used in electronic components market reached $7.9 billion in 2022 and should reach $10.3 billion by 2027, with a compound annual growth rate (CAGR) of 5.5% during the forecast period of 2022-2027.
Report Includes
- 61 data tables and 23 additional tables
- An overview of the global markets and technologies for plastics in electronics components
- Analyses of the global market trends, with data for 2022, 2023 and projections of compound annual growth rates (CAGRs) through 2028
- Estimation of the market size and revenue forecast for plastics in electronics components, and market share analysis by type, end-user, and region
- Highlights of the market opportunities, and major issues and trends affecting the plastic industry
- Insight into the recent industry structure, regulations and policies, pipeline products, and the vendor landscape of the market leading participants
- Company profiles of major players within the industry, including BASF, Covestro AG, Henkel AG, Mitsubishi Engineering-Plastics Corp., and SABIC
Report Highlights
The global electronics components market reached nearly 3.9 billion pounds in 2016. This market is estimated to reach nearly 6.1 billion pounds in 2022 from 4.2 billion pounds in 2017 at a compound annual growth rate (CAGR) of 7.7% for 2017-2022.
Report Includes
- An overview of the global market for plastics in electronic components
- Analyses of global market trends, with data from 2016, estimates for 2017, and projections of compound annual growth rates (CAGRs) through 2022
- Information about pricing of resins, molders of electronic components, testing agencies, and requirements related to electronic components
- Coverage of single devices, such as connectors, capacitors, switches, bobbins, multiple-component devices such as printed circuit boards and interconnects, and encapsulants.
- Comprehensive company profiles of major players in the industry
Report Highlights
The global electronic component market volume was 3.6 billion pounds in 2014. This market should reach nearly 3.8 billion pounds in 2015 and more than 4.4 billion pounds by 2020, demonstrating a compound annual growth rate (CAGR) of 3.3% from 2015 to 2020.
Report Includes
- An overview of the global market for plastics in electronic components.
- Analyses of global market trends, with data from 2014, estimates for 2015, and projections of compound annual growth rates (CAGRs) through 2020.
- Information about pricing of resins, molders of electronic components, testing agencies and requirements related to electronic components.
- Discussion of emerging and developmental technologies and applications that have the greatest commercial potential through 2020.
- Coverage of single devices such as connectors, capacitors, switches, bobbins, multiple-component devices such as printed circuit boards and interconnects, and encapsulants.
- Comprehensive company profiles of major players in the industry.
Report Highlights
The global market for resins used in electronic components reached 3.4 billion pounds in 2011. It is expected to reach 3.5 billion pounds in 2012 and it will further grow to 4.4 billion pounds by 2017, a compound annual growth rate (CAGR) of 4.7%.
Report Highlights
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Thermoplastic and thermoset volumes, estimated at slightly over 586 million pounds in 2006 should reach over 700 million pounds by 2011 corresponding to an annual growth rate of 4.3%.
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Thermoplastics will have the highest growth rate through the forecast period at 4.8%. Consumption is almost 400 million pounds in 2006 and should grow to just over 500 million pounds in 2011.
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In terms of technology driven factors, miniaturization is still an important factor, although it is beginning to reach its saturation point; thinwalling of molded parts; and higher soldering temperatures due to surface mount technologies (SMT) and lead-free soldering have been some of the key parameters affecting choices and volumes of plastics being used to mold components. These factors will drive the use for resins with higher heat deflection temperatures (HDTs) and glass transition temperatures (Tgs) and lower dielectric constants.
Report Highlights
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The total annual consumption of plastics in electronic components in North America was just over 415 million pounds in 2001 and will rise at an AAGR (average annual growth rate) of 3.9% to 503 million pounds in 2006.
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Thermoplastics account for 65% of the market, and growing at a higher AAGR of 4.8% will take nearly 68% in 2006.
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Thermosets will rise at an AAGR of just 2.2% from 145 million pounds to 162 million pounds.
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Three specific applications, namely PCB laminates, encapsulation, and connector molding account for more than 80% of total market volume of the market.
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Nearly 57% of plastics are consumed in stationary computers and peripherals, a number that will dip slightly by 2006.
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The share for portable applications will rise from 7.1% in 2001 to 11.1% in 2006.
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