September 29, 2015
Wellesley, Mass., September 29, 2015 – Growing global demand for smartphones and tablets, particularly in emerging markets like Asia-Pacific, is driving major market growth. BCC Research reveals that this demand, in turn, is increasing consumption of semiconductor wafers and ICs, further driving growth in the global WLP market.
WLP is an IC package completely fabricated at the wafer level and assembled with standard surface mount technology. Basically a chip-scale package (CSP) innovation, WLP permits integration of wafer fab, packaging, test and smolder in at wafer level to streamline the methodology for assembling an electronic device or gadget. By technology, the global wafer-level packaging market comprises seven technologies: Flip chip, 3D WLP, Conventional CSP, Wafer-level CSP, Compliant WLP, Nano-WLP, and Others.
The global wafer-level packaging (WLP) market is anticipated to reach $1.6 billion and $4.9 billion in 2014 and 2019, respectively, growing at a five-year (2014-2019) compound annual growth rate (CAGR) of 24.5%. Flip chip, the largest segment, should easily double its value with a CAGR of 22.7% during the forecast period. The Nano-WLP segment is expected to grow the fastest with a CAGR of 40%. The second-fastest growing segment, 3D WLP, will achieve a CAGR of 28%.
As new technologies emerge and pressure to launch new products increases, flip chip firms are prone toward changes in their manufacturing processes due to different bumping methodologies as well as changes in the raw materials themselves. Market growth of the technology stems from its many advantages over other packaging methods, such as reliability, size, flexibility, performance and cost. The wide availability of flip chip raw materials, equipment and services will continue to drive healthy growth.
“The major factor behind the growth of this segment is consumers’ increased expectations for new products. Increasing demand for new designs of smartphones, tablets, computing devices, smart home components, etc., require chips that can handle a great number of functions without disruptions,” says BCC Research analyst Sinha G. Gaurav. “WLP promises to be a key technology of the future, especially in the semiconductor industry. Increasing global demand for smartphones and tablets, particularly in the emerging markets such as Asia-Pacific and Rest Of World is one of the major drivers in the market.”
Wafer-Level Packaging: Technologies and Global Markets (SMC100A) examines the various applications of the WLP market and market dynamics of each application. The report identifies key trends related to the technologies, applications, integration, and regions (including analysis by country). Data from 2013, 2014, and projections of CAGRs through 2019 are provided.
Editors and reporters who wish to speak with the analyst should contact Steven Cumming at email@example.com.
Wafer-level Packaging: Technologies and Global Markets( SMC100A )
Publish Date: Sep 2015
Data and analysis extracted from this press release must be accompanied by a statement identifying BCC Research LLC as the source and publisher. For media inquiries, email firstname.lastname@example.org or visit www.bccresearch.com/media to request access to our library of market research.