Wafer-level Packaging: Technologies and Global Markets

Report Code: SMC100A

Publish Date: Sep 2015

Publisher: BCC Publishing

Category: Semiconductors

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Report Highlights

The global wafer-level packaging (WLP) market was valued at $1.3 billion in 2013. This market is expected to grow from $1.6 billion in 2014 to $4.9 billion by 2019, with a compound annual growth rate (CAGR) of 24.5% from 2014 to 2019.

 

Report Includes

  • An overview of the global markets and technologies for wafer-level packaging.
  • Analyses of global market trends, with data from 2013 and 2014, and projections of CAGRs through 2019.
  • Coverage of technologies including: Flip-Chip, 3-D WLP, Conventional CSP, Wafer Level CSP, Compliant WLP, Nano WLP, and others.
  • Information on integration techniques including Fan-out WLP, Fan-in WLP, TSV, IPD.
  • Details concerning applications, including consumer electronics,  automotive, industrial, defense and aerospace, medical, and others.
  • A regional analysis: North America, Europe, Asia-Pacific, and RoW.
  • An industry and competitive analysis.
  • A relevant patent analysis.
  • Profiles of major players in the industry.

Report Scope

The scope of the study includes the present and upcoming market trends of WLP, including which mode of integration is most commonly used.

The report covers the WLP market by the following categories and segments:

  • Technology: Flip chip, 3-D WLP, conventional chip-scale package (CSP), wafer-level CSP, compliant WLP, Nano-WLP and others.
  • Integration: Fan-out WLP, Fan-in WLP, Through Silicon Via (TSV), Integrated Passive Device (IPD).
  • Applications: Consumer electronics, automotive, industrial, defense and aerospace, medical, others.
  • Region: North America; Europe; Asia-Pacific and ROW.
  • Industry and competitive analysis.
  • Patent analysis.
  • Company profiles.
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Analyst Credentials

Sinha G. Gaurav, research analyst, holds an MBA in finance from ICFAI Business School, Hyderabad (India), and a bachelor's degree in electrical engineering from Rajasthan University (India). He has worked in almost all domains across the market research industry. He has 11 years of experience in the fields of market research and investment banking. His primary focus is in healthcare, chemicals, electronics, finance and database designing. His publications include subjects such as quantum dots, IT in healthcare, alternative data, ultrafast lasers, inorganic polymers, waste management, factory automation and Voxel, among others.

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Table of Contents

All reports provided in PDF format. For shared licensing options (5+ Users), please call a representative at (+1) 781-489-7301 or contact us at info@bccresearch.com
Title/Chapter NamePagesMember Price
Full Report: Wafer-level Packaging: Technologies and Global Markets148Free
Chapter- 1: INTRODUCTION4Free
Chapter- 2: EXECUTIVE SUMMARY3Free
Chapter- 3: OVERVIEW7Free
Chapter- 4: WAFER-LEVEL PACKAGING MARKET BY INTEGRATION30Free
Chapter- 5: WAFER-LEVEL PACKAGING BY TECHNOLOGY35Free
Chapter- 6: WAFER-LEVEL PACKAGING MARKET BY APPLICATION22Free
Chapter- 7: WAFER-LEVEL PACKAGING BY REGION16Free
Chapter- 8: COMPETITIVE ANALYSIS3Free
Chapter- 9: C. CRAMER & CO. GMBH26Free
Chapter- 10: APPENDIX2Free

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Wafer-level Packaging: Technologies and Global Markets
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