System-in-Package (SiP) Die Technologies and Global Markets

Feb 2014| SMC091A| BCC Publishing

Report Highlights

Global sales for System-in-Package (SiP)-based chipsets totaled nearly $15 billion in 2012. This market is expected to grow at a compound annual growth rate (CAGR) of 6.7% from nearly $16.3 billion forecast for 2013 to $22.5 billion forecast for 2018.

Report Includes

  • An overview of the global market for System-in-Package (SiP) chipsets.
  • Analyses of global market trends, with data from 2012, estimates for 2013, and projections of compound annual growth rates (CAGRs) through 2018.
  • A breakdown of the market along two major criteria; die technologies and end-use applications.
  • A look at many market verticals including telecommunications; medicine; computing and entertainment; consumer electronics, instrumentation and scientific research; energy, defense, and surveillance; and industrial and automotive.
  • Comprehensive profiles of leading companies in the industry.

Report Scope

The report measures and forecasts the size of the market in current U.S. dollars as well as in millions of shipment units for chipsets packaged using SiP.

The report forecasts the market size for the following:

  • Individual end-use application such as telecommunications; instrumentation and scientific research; medicine; energy, defense and surveillance; consumer electronics; industrial and automotive; retail; and others. 
  • The above forecasts are classified in terms of die compositions, geographical regions and countries on volume and value bases; they are also classified in terms of value chain contributors on a value basis.

The Executive Summary provides a snapshot of key findings of the report.

The chapter on theoretical overview of SiP defines SiP and explains its morphology. SiP is placed in the context of other advanced packaging techniques, and a wider view is presented of where semiconductor packaging itself fits in the device-synthesis chain. The chapter dwells on simple and compound semiconductors and elaborates their pros and cons. Further, a high-level view of the SiP market is provided.

The chapter on global markets for SiP-enabled chipsets provides a closer look at the global market for those chipsets. End-use applications are used as the principal classification factor, and individual end-application markets are broken down by region and die composition.

The chapter on regional analysis for the Americas presents an overview of the region and the overall market metrics, followed by analyses of individual major countries such as the U.S., Brazil, Canada and Mexico.

The chapter on regional analysis for EMEA presents an overview of the region and the overall market metrics, followed by analyses of individual major countries such as Germany, France, the U.K., Spain, Italy, Russia, the Netherlands and Turkey.

The chapter on regional analysis for APAC presents an overview of the region and the overall market metrics, followed by analyses of individual major countries such as China, Japan, India, South Korea and Indonesia.

The chapter on major stakeholders and key companies identifies the influential stakeholder categories and leading companies that dominate the market for SiP-based chipsets.

The U.S. Patent Analysis chapter analyzes the U.S. patents granted in the relevant areas of SiP. The chapter classifies the patents awarded according to categories such as: analog–digital converter (ADC), digital–analog converter (DAC), radiofrequency (RF), antenna and other communication-component-specific integration; assembly and integration end-to-end process; bond, resin, solder, interposer and lead frame; design and alignment; die stacking and side-by-side placement facilitation; end-application-specific innovation-data transmission; memory-component-specific innovation; passive component integration; performance testing and verification; and power management, heat sink, inductor and capacitor.

Analyst Credentials

Kaustubha Parkhi has worked in a broad range of functional roles with leading telecommunications operators and service providers such as Reliance Infocomm, Ramco Systems and BPL Cellular. He has written on an array of telecommunications and electronics-related subjects based on his critical analysis of the underlying technology and its business impact. Kaustubha holds a Bachelor of Engineering (equivalent to a Bachelor of Science) in Electronics and Telecommunications and a Master of Business Administration in Systems.

Frequently Asked Questions (FAQs)

Table of Contents

All reports provided in PDF format. For shared licensing options (5+ Users), please call a representative at (+1) 781-489-7301 or contact us at
Title/Chapter NamePagesMember Price
Full Report: System-in-Package (SiP) Die Technologies and Global Markets173Free
Chapter- 1: INTRODUCTION5Free
Chapter- 9: U.S. PATENT ANALYSIS9Free
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