Plastics in Electronics Components: Technologies and Global Markets

Feb 2012| PLS027C| BCC Publishing

Report Highlights

The global market for resins used in electronic components reached 3.4 billion pounds in 2011. It is expected to reach 3.5 billion pounds in 2012 and it will further grow to 4.4 billion pounds by 2017, a compound annual growth rate (CAGR) of 4.7%.

SCOPE AND FORMAT

This study covers all electronic components where plastics are used to a significant extent in mostly molding electronic components and excludes fiber optics, wire and cable, enclosures, recording media, etc.  This study covers single devices (e.g., connectors, capacitors, switches, bobbins), multiple-component devices (e.g., printed circuit boards, interconnects, etc.) and encapsulants.

In addition, key participants in the electronic components industry in terms of resin producers, and molders are identified along with inclusion of key technologies, and the competitive resin scenario.

Analyst Credentials

Melvin Schlechter has thirty years of experience in the chemical industry, specializes in plastics market research and has been a BCC Research analyst for since 2006. Previously, Mr. Schlechter was the International Director of Chemical Reports for Frost & Sullivan. He also worked for the Union Carbide Company as a Senior Market Research Analyst, was a Senior Organic/Polymer Chemist for Stauffer Chemical Company and a Research Organic Chemist for Allied Signal Corporation. Mr. Schlechter holds a B.S. in Chemistry from Queens College, a Masters in Organic Chemistry from Virginia Tech, and an MBA from Adelphi University.

Table of Contents & Pricing

All reports provided in PDF format. For shared licensing options (5+ Users), please call a representative at (+1) 781-489-7301 or contact us at info@bccresearch.com
Title/Chapter Name Pages Price Member Price
Full Report: Plastics in Electronics Components: Technologies and Global Markets 238 $2,750 Free
Chapter- 1: INTRODUCTION2Free
Chapter- 2: SUMMARY3$250Free
Chapter- 3: RESINS USED IN ELECTRONIC COMPONENTS85$982Free
Chapter- 4: RECENT RESIN DEVELOPMENTS RELATED TO ELECTRONIC COMPONENTS1$12Free
Chapter- 5: TICONA ADVANCES1$12Free
Chapter- 6: ELECTRONIC COMPONENT PRODUCTS50$578Free
Chapter- 7: MOLDED ELECTRONIC PRODUCTS24$277Free
Chapter- 8: RECENT PATENTS RELATED TO THE INDUSTRY6$69Free
Chapter- 9: CHANGES IN ELECTRONIC COMPONENT MANUFACTURE WHICH COULD IMPACT RESIN CHOICES2$23Free
Chapter- 10: APPLICATIONS AND INDUSTRY TRENDS17$196Free
Chapter- 11: TECHNOLOGY TRENDS RELATED TO ELECTRONIC COMPONENTS10$116Free
Chapter- 12: ELECTRONIC COMPONENT INDUSTRY OVERVIEW3$35Free
Chapter- 13: RESIN PRODUCERS9$104Free
Chapter- 14: PRICING1$12Free
Chapter- 15: MOLDERS OF ELECTRONIC COMPONENTS1$12Free
Chapter- 16: ENVIRONMENTAL ISSUES5$58Free
Chapter- 17: TESTING AGENCIES AND REQUIREMENTS RELATED TO ELECTRONIC COMPONENTS5$58Free
Chapter- 18: SELECTED COMPANY PROFILES11$127Free
Chapter- 19: ACRONYMS2$23Free
Published - Sep-2006| Analyst - Melvin Schlechter| Code - PLS027B

Report Highlights

  • Thermoplastic and thermoset volumes, estimated at slightly over 586 million pounds in 2006 should reach over 700 million pounds by 2011 corresponding to an annual growth rate of 4.3%.
  • Thermoplastics will have the highest growth rate through the forecast period at 4.8%. Consumption is almost 400 million pounds in 2006 and should grow to just over 500 million pounds in 2011.
  • In terms of technology driven factors, miniaturization is still an important factor, although it is beginning to reach its saturation point; thinwalling of molded parts; and higher soldering temperatures due to surface mount technologies (SMT) and lead-free soldering have been some of the key parameters affecting choices and volumes of plastics being used to mold components. These factors will drive the use for resins with higher heat deflection temperatures (HDTs) and glass transition temperatures (Tgs) and lower dielectric constants.

Published - Jul-2002| Analyst - Melvin Schlechter| Code - PLS027A

Report Highlights

  • The total annual consumption of plastics in electronic components in North America was just over 415 million pounds in 2001 and will rise at an AAGR (average annual growth rate) of 3.9% to 503 million pounds in 2006.
  • Thermoplastics account for 65% of the market, and growing at a higher AAGR of 4.8% will take nearly 68% in 2006.
  • Thermosets will rise at an AAGR of just 2.2% from 145 million pounds to 162 million pounds.
  • Three specific applications, namely PCB laminates, encapsulation, and connector molding account for more than 80% of total market volume of the market.
  • Nearly 57% of plastics are consumed in stationary computers and peripherals, a number that will dip slightly by 2006.
  • The share for portable applications will rise from 7.1% in 2001 to 11.1% in 2006.

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