Atomic Layer Deposition and other Ultrathin-Film Fabrication Processes
The global market for atomic layer deposition and other ultrathin film fabrication processes was valued at $1.1 billion and $1.3 billion in 2014 and 2015, respectively. This market is expected to increase from $1.5 billion in 2016 to nearly $3.7 billion in 2021 at a compound annual growth rate (CAGR) of 19.1% for 2016-2021.
- An overview of the global markets for atomic layer deposition and other ultrathin-film fabrication processes.
- Analyses of global market trends, with data from 2014 and 2015, estimates for 2016 and projections of compound annual growth rates (CAGRs) through 2021.
- Focused coverage of materials, equipment, and fabrication technologies.
- A look at existing fields of application for atomic layer deposition as well as emerging applications.
- Coverage of these processes in relation to industry segments such as electronics, mechanical, chemical, energy, optics, medical, biological, dental, medical, and nanotechnology.
- Analysis of the market's dynamics, specifically growth drivers, restraints, and opportunities.
- Profiles of major players in the industry.
This report provides an updated review of atomic layer deposition and other ultrathin film deposition technologies, and identifies current and emerging applications for these technologies.
BCC Research delineates the current market status for ultrathin film deposition equipment, defines trends and presents growth forecasts for the next five years. The UTFE market is analyzed based on the following segments: process, application and region. In addition, technological issues, including key events and the latest process developments, are discussed.
More specifically, the market analysis conducted by BCC Research for this report is divided into five sections.
In the first section, an introduction to the topic and a historical review of atomic layer deposition are provided, including an outline of recent events. In this section, current and emerging applications for ALD and other ultrathin film fabrication processes are also identified and grouped in segments (electronics, optoelectronics, mechanical/chemical, sensors and instrumentation, energy, optical coatings, life sciences, and others).
The second section provides a review of deposition technologies for ultrathin films. This section offers a revised and detailed description of various thin film coating processes; existing deposition methods for ultrathin films; and new and emerging fabrication processes. This section concludes with an analysis of the most important technological developments since 2013, including examples of significant patents recently issued or applied for, as well as highlighting the most active research organizations operating in this field.
The third section entails a global market analysis for UTFE. Global revenues (sales data in millions of dollars) are presented for each segment (process, application and region), with actual data referring to the years 2014 and 2015, and estimates for 2016.
The analysis of current UTFE revenues is followed by a detailed presentation of market growth trends, based on industry growth, technological trends and regional trends. The third section concludes by providing projected UTFE revenues within each segment, together with forecast compound annual growth rates (CAGRs) for the period 2016 through 2021.
In the fourth section of the study, which covers global industry structure, the report offers a list of the leading suppliers of UTFE, together with a description of their products. The analysis includes a description of the geographical distribution of these firms and an evaluation of other key industry players. Detailed company profiles of the top players are also provided.
The fifth and final section includes an analysis of recently issued U.S. patents, with a summary of patents related to ultrathin film fabrication methods, equipment and applications. Patent analysis is performed by region, country, assignee, patent category, application and process type.
Margareth Gagliardi has extensive experience in the field of advanced materials, specializing in ceramic formulations, materials processing, and new product development. For more than 20 years, she has held management positions in both manufacturing and R&D within U.S. and European firms producing electronic, mechanical, chemical and structural components. She currently works as a consultant serving a variety of organizations and research institutions. She holds a B.S. in Chemical Engineering and an M.S. in Ceramic Engineering.
- Global atomic layer deposition market was worth approximately $318 million in 2008. This market decreased to $199 million in 2009 under the impact of the recession in many of the world’s major economies, it is projected to grow to nearly $978 million between 2009 and 2014, at a CAGR of 37.5% over the 5-year period
- Equipment market was nearly $231 million in 2008; this further decreased to $121 million in 2009, this is projected to reach $579 million in 2014, for a 5-year CAGR of 36.8%.
- Materials market was $87 million in 2008; this further decreased to $78 million in 2009, this is projected to reach $399.5 million in 2014, for a 5-year CAGR of 38.5%.
The worldwide global market for atomic layer deposition increased from $151.6 million in 2003 to an estimated $214.1 million by the end of 2005.
Process equipment sales represent the largest share of this market. Their average annual growth rate (AAGR) is projected to be 23.1% over the next five years, resulting in global ALD system sales of $487.3 million by 2010.
Raw materials revenue growth, driven by the utilization of ALD for the deposition of metal oxide films and other future fast growing applications such as the deposition of high-k gate oxides and nitridebased barrier layers, is projected to grow at an AAGR of 25.6% for the next five years and reach $130.3 million by 2010.
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