Printed Circuit Boards: Technologies and Global Markets

Published - Jun 2016| Analyst - Kaustubha Parkhi| Code - SMC103A
Printed Circuit Boards: Technologies and Global Markets
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Report Highlights

The global market for printed circuit boards (PCBs) reached nearly $61.5 billion in 2015. The market is expected to reach nearly $73.8 billion by 2021 from $63.5 billion in 2016, increasing at a compound annual growth rate (CAGR) of 3.1% from 2016 to 2021.

Report Includes

  • An overview of the global markets and related technologies for printed circuit boards.
  • Analyses of global market trends, with data for 2015, estimates for 2016, and projections of CAGRs through 2021.
  • Breakdowns and analysis by structure: 
    • Multilayer
    • Flexible
    • Rigid-flex
    • Microvia
    • Substrate 
  • Breakdowns by application: 
    • Telecommunications
    • Medicine
    • Computing and entertainment
    • Consumer electronics
    • Instrumentation and scientific research
    • Energy, defense, and surveillance
    • Industrial and automotive
  • Analysis of the value chain including looks at material specialists, board makers, engineering manufacturing service providers and OEMs.
  • Profiles of major players in the industry.

Report Scope

This report forecasts the size of the market in current U.S. dollars and shipment volumes from 2015 to 2021.

The report forecasts the market size for PCBs used in end applications, including mobile phones and tablets; networking devices; instrumentation and scientific research; medicine; defense, surveillance and aviation; energy; consumer electronics; computing and storage; industrial; automotive and transportation; and retail. Forecasts for individual end applications are classified on the basis of PCB type and geographic region.

Chapter Two is an executive summary that provides a snapshot of the key findings of the report.

Chapter Three provides an overview of PCBs and introduces the various types. It also provides an overview of the market and breaks in down by type, geographical region and end application.

Chapter Four analyzes the global PCB market and highlights the characteristics of PCB adoption in end applications. Each end application is further broken down by PCB type and geographical region.

Chapter Five presents a stakeholder analysis that identifies major stakeholder categories associated with PCB technologies, explains the dynamics of individual categories and highlights pertinent representative examples.

Chapter Six analyzes U.S. patents granted in areas relevant to PCBs.

Analyst Credentials

Kaustubha Parkhi has worked in a wide range of functional roles with leading telecommunications operators and service providers such as Reliance Infocomm, Ramco Systems and BPL Cellular. He has written about an array of telecommunications and electronics-related subjects based on his critical analysis of the underlying technology and its business impacts. Mr. Parkhi holds a Bachelor of Engineering (equivalent of Bachelor of Science) in electronics and telecommunications and an MBA in systems.

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