Thermal Scanning Probe Lithography: Continuing the Path to Semiconductor Miniaturization
Report Highlights
The idea of massively parallel atomic probe arrays has been around for decades, but can the tip speed, durability and finished results be scaled commercially?
If so, advantages over electron beam methods, especially in semiconductor manufacture, may be worth the efforts – ambient versus vacuum atmosphere, 2D transistors quality improvements improving flow of electrons at the intersection of metal and the 2D substrate, easily image the 2D semiconductor and then pattern the electrodes where desired, lower operational costs, reduced power consumption, and so forth.
Report Includes
- Technological highlights and market outlook of thermal scanning probe lithography (tSPL) as a mean to semiconductor miniaturization
- Insight into the role of tSPL process in diverse industry sectors, including electronics and optoelectronics; chemistry, biochemistry and healthcare; sensors and actuators; energy; and fabrication of 3D structures on transparent substrates etc.
- Summary of lithographic processes for creating electronic features using deposition technologies for ultrathin films
- An assessment of current trends, technology status, strengths and drawbacks, and emerging applications of tSPL at the industrial level
Analyst Credentials
Margareth Gagliardi, Chief Research Analyst in Advanced Materials for BCC Research, has more than 30 years of experience in the field of advanced materials, specializing in ceramic formulations, materials processing, and new product development. After receiving her degrees in Chemical and Ceramic Engineering, she worked in both manufacturing and R&D holding senior management positions within U.S. and European firms producing electronic, mechanical, chemical, and structural components.
She is currently focusing on market intelligence and advanced technologies analysis for organizations and research institutions that operate within a range of high-tech industries.