Thermal Scanning Probe Lithography: Continuing the Path to Semiconductor Miniaturization

Apr 2019| SMC116A| BCC Publishing

Report Highlights

The idea of massively parallel atomic probe arrays has been around for decades, but can the tip speed, durability and finished results be scaled commercially?

If so, advantages over electron beam methods, especially in semiconductor manufacture, may be worth the efforts – ambient versus vacuum atmosphere, 2D transistors quality improvements improving flow of electrons at the intersection of metal and the 2D substrate, easily image the 2D semiconductor and then pattern the electrodes where desired, lower operational costs, reduced power consumption, and so forth.

Report Includes

  • Technological highlights and market outlook of thermal scanning probe lithography (tSPL) as a mean to semiconductor miniaturization
  • Insight into the role of tSPL process in diverse industry sectors, including electronics and optoelectronics; chemistry, biochemistry and healthcare; sensors and actuators; energy; and fabrication of 3D structures on transparent substrates etc.
  • Summary of lithographic processes for creating electronic features using deposition technologies for ultrathin films
  • An assessment of current trends, technology status, strengths and drawbacks, and emerging applications of tSPL at the industrial level


Analyst Credentials

Margareth Gagliardi has extensive experience in the field of advanced materials, specializing in ceramic formulations, materials processing, and new product development. For more than 20 years, she has held management positions in both manufacturing and R&D within U.S. and European firms producing electronic, mechanical, chemical and structural components. She currently works as a consultant serving a variety of organizations and research institutions. She holds a B.S. in Chemical Engineering and an M.S. in Ceramic Engineering.

Table of Contents & Pricing

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